CY8CLED04D01-56LTXI Cypress Semiconductor Corp, CY8CLED04D01-56LTXI Datasheet - Page 46

• Manufacturer Part Number: CY8CLED04D01-56LTXI
• Description: IC POWERPSOC 4CH 1A 56VQFN
• Manufacturer: Cypress Semiconductor Corp
• Series: PowerPSoC® CY8CLEDr

Specifications of CY8CLED04D01-56LTXI

• Package / Case: 56-VQFN Exposed Pad, 56-HVQFN, 56-SQFN, 56-DHVQFN
• Core Processor: M8C
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: DALI, DMX512, I²C, IrDA, SPI, UART/USART
• Peripherals: LED, LVD, POR, PWM, WDT
• Number Of I /o: 14
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4.75 V ~ 5.25 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Operating Supply Voltage: 7 V to 32 V
• Maximum Supply Current: 50 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 428-2882 - KIT STARTER POWERPSOC LIGHTING428-2281 - KIT EVAL POWERPSOC LIGHTING428-2271 - KIT EVAL COLOR-LOCK428-2270 - KIT STARTER DEMO LIGHTING770-1000 - ISP 4PORT FOR CYPRESS PSOC MCU
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 428-2279

18. Packaging Information
Packaging Dimensions
This section illustrates the package specification for the CY8CLED04D0X, CY8CLED03D0X, CY8CLED04G01, and CY8CLED03G01
along with the thermal impedance for the package and solder reflow peak temperatures.
Important Note For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
18.1 Thermal Impedance
18.2 Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to
achieve good solderability.
19. Development Tools
19.1 Software
This section presents the development tools available for all
current PSoC device families including the CY8CLED04D0X,
CY8CLED03D0X, CY8CLED04G01, and CY8CLED03F01.
Document Number: 001-46319 Rev. *E
Notes
9. T
10. To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane.
11. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
Refer to the solder manufacturer specifications.
Package
J
56 QFN
= T
A
56 QFN
+ POWER x
Package
[10]
θ
JA
Temperature
Minimum Peak
240
o
C
[11]
Typical θ
16.6
Maximum Peak
Temperature
o
Figure 18-1. 56-Pin (8x8 mm) QFN
C/W
260
JA
[9]
o
C
19.1.1 PSoC Designer 5.0
At the core of the PSoC development software suite is PSoC
Designer. Used by thousands of PSoC developers, this robust
software has been facilitating PSoC designs for half a decade.
PSoC Designer is available free of charge at under Design
Resources > Software and Drivers.
19.1.2 PSoC Programmer
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or it can operate
directly from PSoC Designer 5.0. PSoC Programmer software is
compatible with both PSoC ICE-Cube In-Circuit Emulator and
PSoC MiniProg. PSoC programmer is available free of charge at
http://www.cypress.com/psocprogrammer.
19.2 Build a PSoC Emulator into Your Board
For details on how to emulate your circuit before going to volume
production using an on-chip debug (OCD) non-production
PowerPSoC device, see AN2323, Debugging - Build a PSoC
Emulator into Your Board.
.
CY8CLED04G01, CY8CLED03G01
CY8CLED04D01, CY8CLED04D02
CY8CLED03D01, CY8CLED03D02
o
C with Sn-Pb or 245 ± 5
™
o
C with Sn-Ag-Cu paste
001-45705 **
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