MC9S12XET256CAG Freescale Semiconductor, MC9S12XET256CAG Datasheet - Page 1111

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MC9S12XET256CAG

Manufacturer Part Number
MC9S12XET256CAG
Description
MCU 16BIT 256K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XET256CAG

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 24x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
S12XE
Core
HCS12
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 28 768 KByte Flash Module (S12XFTM768K4V2)
28.4.1.2.1
Define FCCOB Contents
The FCCOB parameter fields must be loaded with all required parameters for the Flash command being
executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX
register (see
Section
28.3.2.3).
The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears
the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag
will remain clear until the Flash command has completed. Upon completion, the Memory Controller will
return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic
command write sequence is shown in
Figure
28-26.
MC9S12XE-Family Reference Manual , Rev. 1.23
Freescale Semiconductor
1111

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