MC9S12XET256CAG Freescale Semiconductor, MC9S12XET256CAG Datasheet - Page 1207

• Manufacturer Part Number: MC9S12XET256CAG
• Description: MCU 16BIT 256K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XET256CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XE
• Core: HCS12
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Freescale Semiconductor
Human Body
Charged Device Number of pulse per pin
Latch-up
Num
1
2
3
4
Model
C
C
C
C
C
Series resistance
Storage capacitance
Number of pulse per pin
Minimum input voltage limit
Maximum input voltage limit
Human Body Model (HBM)
Charge Device Model (CDM) corner pins
Charge Device Model (CDM) edge pins
Latch-up current at T
Latch-up current at T
Positive
Negative
Positive
Negative
Positive
Negative
Positive
Negative
Table A-3. ESD and Latch-Up Protection Characteristics
Table A-2. ESD and Latch-up Test Conditions
MC9S12XE-Family Reference Manual Rev. 1.23
A
A
= 125°C
= 27°C
Rating
Description
Symbol
V
V
I
I
HBM
CDM
LAT
LAT
Appendix A Electrical Characteristics
Symbol
+100
+200
2000
–100
–200
Min
750
500
R1
—
—
—
—
C
Value
1500
–2.5
Max
100
7.5
—
—
—
—
—
—
—
1
1
3
3
Ohm
Unit
Unit
mA
mA
pF
V
V
V
V
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