DSPIC30F2010-30I/SO Microchip Technology, DSPIC30F2010-30I/SO Datasheet - Page 201

IC DSPIC MCU/DSP 12K 28SOIC

DSPIC30F2010-30I/SO

Manufacturer Part Number
DSPIC30F2010-30I/SO
Description
IC DSPIC MCU/DSP 12K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F2010-30I/SO

Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
20
Flash Memory Size
12KB
Supply Voltage Range
2.5V To 5.5V
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
20
Interface Type
I2C/SPI/UART
On-chip Adc
6-chx10-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2010-30I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
DSPIC30F2010-30I/SO
Quantity:
5 000
Part Number:
DSPIC30F2010-30I/SOG
Manufacturer:
TOS
Quantity:
453
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2011 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F2010AT-20E/SO = 20 MIPS, Extended temp., SOIC package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 2 0 1 0 AT- 2 0 E / S O - E S
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
dsPIC30F2010
Custom ID (3 digits) or
Engineering Sample (ES)
Package
MM = QFN-S
SP = SPDIP
SO = SOIC
S
W
A,B,C… = Revision Level
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
DS70118J-page 201
Speed
20 = 20 MIPS
30 = 30 MIPS

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