XK-Z11-M Digi International, XK-Z11-M Datasheet - Page 17

• Manufacturer Part Number: XK-Z11-M
• Description: ZIGBEE MODULE DEVELOPMENT KIT
• Manufacturer: Digi International
• Series: XBee™r
• Type: Transceiver, 802.15.4/ZigBeer

Specifications of XK-Z11-M

• Frequency: 2.4GHz
• For Use With/related Products: XBee Modules
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 602-1184

© 2010 Digi International, Inc.
XBee®/XBee‐PRO® ZB RF Modules
Electrical Characteristics
Module Operation for Programmable Variant
DC Characteristics of the XBee/XBee‐PRO
Symbol
I
OH +
V
V
I
I
I
V
V
I
V
V
OHS
OHH
OLH
R
I
OLS
REFI
IADC
R
IIN
OH
OL
IH
IL
IS
I
I
Note – The signal-ended ADC measurements are limited in their range and only guaranteed for accuracy in
the range 0 to VREFI. The nature of the ADC’s internal design allows for measurements outside of this range
(+/- 200mV), but the accuracy of such measurements are not guaranteed.
The S2B modules that have the programmable option populated have a secondary processor with 32k of flash
and 2k of RAM. This allows module integrators to put custom code on the XBEE module to fit their own unique
needs. The DIN, DOUT, RTS, CTS, and RESET lines are intercepted by the secondary processor to allow it to be
in control of the data transmitted and received. All other lines are in parallel and can be controlled by either
the EM250 or the MC9SO8QE micro (see Block Diagram for details). The EM250 by default has control of
certain lines. These lines can be released by the EM250 by sending the proper command(s) to disable the
desired DIO line(s) (see XBEE Command Reference Tables).
In order for the secondary processor to sample with ADCs, the XBEE pin 14 (VREF) needs to be connected to
a reference voltage.
Digi provides a bootloader that can take care of programming the processor over the air or through the serial
interface. This means that over the air updates can be supported through an XMODEM protocol. The processor
can also be programmed and debugged through a one wire interface BKGD (Pin 8).
OL
Total output current for all I/O pins
Output sink current (high current)
Output source current (standard)
Output sink current (standard
Output source current (high
ADC input voltage range
Input Leakage Current
Output High Voltage
Output Low Voltage
Input High Voltage
Input Low Voltage
Input impedance
Input Impedance
VREF Internal
Parameter
current)
RSSI/PWM, DIO10, DIO4 digital outputs
RSSI/PWM, DIO10, DIO4 digital outputs
EM250 has an internal reference that is
V
IN
= VCC or GND, all inputs, per pin
When not taking a sample
RSSI/PWM, DIO10, DIO4
RSSI/PWM, DIO10, DIO4
All digital outputs except
All digital inputs except
When taking a sample
All digital outputs
All Digital Inputs
All Digital Inputs
VCC >= 2.7 V
VCC >= 2.7 V
Condition
fixed
0.8 * VCC
0.82*VCC
1.19
Min
10
0
1
-
-
-
Typical
1.2
-
-
-
-
-
0.2 * VCC
0.18*VCC
VREFI
0.5uA
Max
1.21
40
4
8
4
8
-
-
M Ohm
M Ohm
Units
mA
mA
mA
mA
mA
17
uA
V
V
V
V
V
V