FOD817BS Fairchild Semiconductor, FOD817BS Datasheet - Page 11
![Transistor Output Optocouplers TRANSISTOR OUTPUT SMD LEAD BEND](/photos/15/85/158571/sdip-4_sml.jpg)
FOD817BS
Manufacturer Part Number
FOD817BS
Description
Transistor Output Optocouplers TRANSISTOR OUTPUT SMD LEAD BEND
Manufacturer
Fairchild Semiconductor
Datasheet
1.FOD817D300.pdf
(12 pages)
Specifications of FOD817BS
Maximum Fall Time
18 us
Maximum Input Diode Current
50 mA
Maximum Reverse Diode Voltage
6 V
Maximum Rise Time
18 us
Output Device
Transistor
Output Type
DC
Configuration
1
Input Type
DC
Maximum Collector Emitter Voltage
70 V
Maximum Collector Emitter Saturation Voltage
200 mV
Isolation Voltage
5000 Vrms
Current Transfer Ratio
260 %
Maximum Forward Diode Voltage
1.4 V
Maximum Collector Current
50 mA
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 110 C
Minimum Operating Temperature
- 55 C
Package / Case
PDIP SMD Black
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FOD817BSD
Manufacturer:
TI
Quantity:
12 000
©2006 Fairchild Semiconductor Corporation
FOD814 Series, FOD817 Series Rev. 1.1.4
Lead Free Recommended IR Reflow Condition
Recommended Wave Soldering condition
Profile Feature
Preheat condition
(Tsmin-Tsmax / ts)
Melt soldering zone
Peak temperature (Tp)
Ramp-down rate
Profile Feature
Peak temperature (Tp)
Tsmax
Tsmin
25 C
Tp
ts (Preheat)
Pb-Sn solder assembly
100°C ~ 150°C
6°C/sec max.
60 ~ 120 sec
60 ~ 120 sec
240 +0/-5°C
183°C
Time (sec)
11
For all solder assembly
Max 260°C for 10 sec
Soldering zon
Ramp-down
Lead Free assembly
150°C ~ 200°C
6°C/sec max.
60 ~120 sec
260 +0/-5°C
30 ~ 90 sec
217°C
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