A2F500M3G-FGG256 Actel, A2F500M3G-FGG256 Datasheet - Page 63
![FPGA - Field Programmable Gate Array 500K System Gates](/photos/16/14/161496/lpsilverchip_sml.jpg)
A2F500M3G-FGG256
Manufacturer Part Number
A2F500M3G-FGG256
Description
FPGA - Field Programmable Gate Array 500K System Gates
Manufacturer
Actel
Datasheet
1.A2F500M3G-FGG256.pdf
(192 pages)
Specifications of A2F500M3G-FGG256
Processor Series
A2F500
Core
ARM Cortex M3
Number Of Logic Blocks
24
Maximum Operating Frequency
100 MHz
Number Of Programmable I/os
117
Data Ram Size
64 KB
Delay Time
50 ns
Supply Voltage (max)
3.6 V
Supply Current
2 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
A2F-Eval-Kit, A2F-Dev-Kit, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
1.5 V
Number Of Gates
500000
Package / Case
FPBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
A2F500M3G-FGG256
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
A2F500M3G-FGG256I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
A2F500M3G-FGG256I
Manufacturer:
MICROSEMI/美高森美
Quantity:
20 000
DDR Module Specifications
Input DDR Module
Figure 2-19 • Input DDR Timing Model
Table 2-73 • Parameter Definitions
Parameter Name
t
t
t
t
t
t
t
t
CLK
Data
DDRICLKQ1
DDRICLKQ2
DDRISUD
DDRIHD
DDRICLR2Q1
DDRICLR2Q2
DDRIREMCLR
DDRIRECCLR
CLR
INBUF
CLKBUF
INBUF
Clock-to-Out Out_QR
Clock-to-Out Out_QF
Data Setup Time of DDR input
Data Hold Time of DDR input
Clear-to-Out Out_QR
Clear-to-Out Out_QF
Clear Removal
Clear Recovery
A
B
C
Parameter Definition
R e v i s i o n 6
Input DDR
DDR_IN
SmartFusion Intelligent Mixed Signal FPGAs
FF1
FF2
Measuring Nodes (from, to)
D
E
B, D
C, D
B, E
A, B
A, B
C, E
C, B
C, B
Out_QF
(to core)
Out_QR
(to core)
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