AD5522JSVDZ Analog Devices Inc, AD5522JSVDZ Datasheet - Page 15

• Manufacturer Part Number: AD5522JSVDZ
• Description: IC, DAC, 16BIT, QFP-80
• Manufacturer: Analog Devices Inc

Specifications of AD5522JSVDZ

• Resolution (bits): 16bit
• Input Channel Type: Serial
• Supply Voltage Range - Digital: 2.3V To 5.25V
• Supply Current: 36mA
• Digital Ic Case Style: QFP
• No. Of Pins: 80
• Data Interface: LVDS, Serial
• Design Resources: Parametric Measurement Unit and Supporting Components for PAD Appls Using AD5522 and AD7685 (CN0104)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage, AVDD to AVSS
AVDD to AGND
AVSS to AGND
VREF to AGND
DUTGND to AGND
REFGND to AGND
DVCC to DGND
AGND to DGND
Digital Inputs to DGND
Analog Inputs to AGND
Storage Temperature Range
Operating Junction Temperature
Reflow Soldering
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Range (J Version)
Rating
34 V
−0.3 V to +34 V
+0.3 V to −34 V
−0.3 V to +7 V
AVDD + 0.3 V to AVSS − 0.3 V
AVDD + 0.3 V to AVSS − 0.3 V
−0.3 V to +7 V
−0.3 V to +0.3 V
−0.3 V to DVCC + 0.3 V
AVSS − 0.3 V to AVDD + 0.3 V
−65°C to +125°C
25°C to 90°C
JEDEC Standard (J-STD-020)
150°C max
Rev. D | Page 15 of 64
THERMAL RESISTANCE
Thermal resistance values are specified for the worst-case
conditions, that is, a device soldered in a circuit board for
surface-mount packages.
Table 5. Thermal Resistance
Package Type
TQFP Exposed Pad on Bottom
TQFP Exposed Pad on Top
1
2
3
4
ESD CAUTION
The information in this section is based on simulated thermal information.
These values apply to the package with no heat sink attached. The actual
thermal performance of the package depends on the attached heat sink and
environmental conditions.
Natural convection at 55°C ambient. Assumes perfect thermal contact
between the cooling plate and the exposed paddle.
N/A means not applicable.
No Heat Sink
With Cooling Plate at 45°C
No Heat Sink
With Cooling Plate at 45°C
2
2
3
3
1
(JEDEC 4-Layer (1S2P) Board)
Airflow
(LFPM)
0
200
500
N/A
0
200
500
N/A
4
4
θ
22.3
17.2
15.1
5.4
42.4
37.2
35.7
3.0
JA
θ
4.8
4.8
2
2
JC
AD5522
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W