GS816032BGT-200 GSI TECHNOLOGY, GS816032BGT-200 Datasheet - Page 21

• Manufacturer Part Number: GS816032BGT-200
• Description: 18M SYNCH BURST SRAM 512KX32, SMD
• Manufacturer: GSI TECHNOLOGY

Specifications of GS816032BGT-200

• Memory Size: 18Mbit
• Clock Frequency: 200MHz
• Access Time: 6.5ns
• Supply Voltage Range: 2.3V To 2.7V, 3V To 3.6V
• Memory Case Style: TQFP
• No. Of Pins: 100
• Operating Temperature Range: 0°C To +70°C
• Memory Configuration: 512K X 32
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TQFP Package Drawing (Package T)
Rev: 1.03 9/2005
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Notes:
1.
2.
Symbol
A1
A2
D1
E1
L1
All dimensions are in millimeters (mm).
Package width and length do not include mold protrusion.
D
E
Y
θ
b
c
e
L
Terminal Dimension
Terminal Dimension
Body Thickness
Lead Thickness
Description
Package Body
Package Body
Lead Length
Foot Length
Lead Width
Coplanarity
Lead Angle
Lead Pitch
Standoff
Min. Nom. Max
0.05
1.35
0.20
0.09
21.9
19.9
15.9
13.9
0.45
—
—
0°
0.10
1.40
0.30
22.0
20.0
16.0
14.0
0.65
0.60
1.00
—
—
0.15
1.45
0.40
0.20
22.1
20.1
16.1
14.1
0.75
0.10
—
—
7°
21/24
L1
A1
L
e
b
A2
θ
c
GS816018/32/36BT-250/200/150
E1
E
© 2004, GSI Technology