IS62WV5128BLL-55HLI INTEGRATED SILICON SOLUTION (ISSI), IS62WV5128BLL-55HLI Datasheet - Page 13
IS62WV5128BLL-55HLI
Manufacturer Part Number
IS62WV5128BLL-55HLI
Description
SRAM, 512K X 8, 3V, 55NS, 32STSOP1
Manufacturer
INTEGRATED SILICON SOLUTION (ISSI)
Datasheet
1.IS62WV5128BLL-55HLI.pdf
(17 pages)
Specifications of IS62WV5128BLL-55HLI
Memory Size
4Mbit
Access Time
55ns
Supply Voltage Range
2.5V To 3.6V
Memory Case Style
TSOP-1
No. Of Pins
32
Operating Temperature Range
-40°C To +85°C
Memory Configuration
512K X 8
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IS62WV5128BLL-55HLI
Manufacturer:
ISSI
Quantity:
6 000
Company:
Part Number:
IS62WV5128BLL-55HLI
Manufacturer:
ISSI
Quantity:
1 000
Company:
Part Number:
IS62WV5128BLL-55HLI
Manufacturer:
ISSI
Quantity:
262
Part Number:
IS62WV5128BLL-55HLI
Manufacturer:
ISSI
Quantity:
20 000
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. F
06/18/03
PACKAGING INFORMATION
Plastic TSOP
Package Code: T (Type II)
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
E1
A
C
D
E
b
e
L
α
N
1
.
Min
Millimeters
20.82 21.08
10.03 10.29
11.56 11.96
—
0.05
0.30
0.12
0.40
0°
1.27 BSC
0.95 REF
ZD
Max
1.20
0.15
0.52
0.21
0.60
5°
e
32
—
Min
D
0.002 0.006
0.012 0.020
0.005 0.008
0.820 0.830
0.391 0.400
0.451 0.466
0.050 BSC
0.016 0.024
0°
Inches
0.037 REF
Max
0.047
5°
Plastic TSOP (T - Type II)
N/2+1
N/2
b
18.31 18.52
10.03 10.29
11.56 11.96
—
Min
Millimeters
0.05
0.30
0.12
0.41
0°
0.80 BSC
0.81 REF
1-800-379-4774
E1
A
Max
1.20
0.15
0.45
0.21
0.60
5°
A1
44
E
—
Min
0.002 0.006
0.012 0.018
0.005 0.008
0.721 0.729
0.395 0.405
0.455 0.471
0.016 0.024
0°
0.032 BSC
Inches
0.032 REF
SEATING PLANE
Max
0.047
5°
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing
3. Dimensions D and E1 do not
4. Formed leads shall be planar with
L
unless otherwise specified.
between centers.
include mold flash protrusions and
should be measured from the
bottom of the package.
respect to one another within
0.004 inches at the seating plane.
20.82 21.08
10.03 10.29
11.56 11.96
—
Min
Millimeters
0.05
0.30
0.12
0.80 BSC
0.40
0°
0.88 REF
Max
1.20
0.15
0.45
0.21
0.60
5°
50
—
Min
0.002 0.006
0.012 0.018
0.005 0.008
0.820 0.830
0.395 0.405
0.455 0.471
0.016 0.024
0°
0.031 BSC
0.035 REF
Inches
α
Max
0.047
5°
C