PIC16LF819T-I/SSTSL Microchip Technology, PIC16LF819T-I/SSTSL Datasheet - Page 269

• Manufacturer Part Number: PIC16LF819T-I/SSTSL
• Description: IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SSOP,20PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16LF819T-I/SSTSL

• Rohs Compliant: YES
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: PIC16LF819TISSTSL

21.0
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................. .-40°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA
© 2008 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows:
2: Voltage spikes below V
ELECTRICAL CHARACTERISTICS
Pdis = V
latch-up. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/V
RE3 pin, rather than pulling this pin directly to V
DD
with respect to V
DD
IK
OK
x {I
(V
DD
I
SS
(V
DD
< 0 or V
pin ..............................................................................................................................250 mA
O
pin ...........................................................................................................................300 mA
– ∑ I
< 0 or V
SS
OH
I
SS
SS
SS
> V
(†)
......................................................................................................... -0.3V to +7.5V
} + ∑ {(V
(Note 2) ......................................................................................... 0V to +13.25V
O
at the MCLR/V
(except V
DD
> V
)...................................................................................................................... ±20 mA
DD
DD
) .............................................................................................................. ±20 mA
DD
– V
and MCLR) ................................................... -0.3V to (V
OH
PP
) x I
/RE3 pin, inducing currents greater than 80 mA, may cause
OH
SS
} + ∑(V
.
OL
x I
PIC18F2450/4450
OL
)
DS39760D-page 267
DD
+ 0.3V)
PP
/