CYII4SC014KAA-GTC Cypress Semiconductor Corp, CYII4SC014KAA-GTC Datasheet - Page 26

IC SENSOR IMAGE COLOR 49-PGA

CYII4SC014KAA-GTC

Manufacturer Part Number
CYII4SC014KAA-GTC
Description
IC SENSOR IMAGE COLOR 49-PGA
Manufacturer
Cypress Semiconductor Corp
Type
CMOS Imagingr
Datasheet

Specifications of CYII4SC014KAA-GTC

Package / Case
49-PGA
Pixel Size
8µm x 8µm
Active Pixel Array
3048H x 4560V
Frames Per Second
3
Voltage - Supply
3.3V
Operating Supply Voltage
3.6 V
Maximum Operating Temperature
+ 50 C
Minimum Operating Temperature
0 C
Image Size
4560 H x 3048 V
Color Sensing
Color
Package
49PGA
Operating Temperature
0 to 50 °C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Other names
IBIS4-14000-C
IBIS4-14000-C
Information on lead free soldering
CYII4SM014KAA-GEC: The product is tested successfully for
Pb-free soldering processes using a reflow temperature profile
with maximum 260°C, minimum 40s at 255°C and minimum 90s
at 217°C.
CYII4SC014KAA-GTC: The product will not withstand a Pb-free
soldering process. Maximum allowed reflow or wave soldering
temperature is 220°C. Hand soldering is recommended for this
part type.
Note “Intentional content” is defined as any material demanding
special attention is contained into the inquired product by
following cases:
Defect Specification
A document called “IBIS4-14000 Defect Specification” is available on request. This documents contains the criteria against which the
IBIS4-14000 is tested before being shipped. Contact Cypress for more information (imagesensors@cypress.com).
Document #: 38-05709 Rev. *D
The following case is not treated as “intentional content”:
1. A case that the above material is added as a chemical com-
2. A case that the above material, which is used intentionally in
1. A case that the above material is contained as an impurity into
position into the inquired product intentionally in order to pro-
duce and maintain the required performance and function of
the intended product .
the manufacturing process, is contained in or adhered to the
inquired product
raw materials or parts of the intended product. The impurity is
defined as a substance that cannot be removed industrially,
or it is produced at a process such as chemical composing or
reaction and it cannot be removed technically.
CYII4SM014KAA-GEC
CYII4SC014KAA-GTC
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