TPCA8010-H(TE12LQM Toshiba, TPCA8010-H(TE12LQM Datasheet - Page 6

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TPCA8010-H(TE12LQM

Manufacturer Part Number
TPCA8010-H(TE12LQM
Description
MOSFET N-CH 200V 5.5A SOP-8 ADV
Manufacturer
Toshiba
Datasheet

Specifications of TPCA8010-H(TE12LQM

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
450 mOhm @ 2.7A, 10V
Drain To Source Voltage (vdss)
200V
Current - Continuous Drain (id) @ 25° C
5.5A
Vgs(th) (max) @ Id
4V @ 1mA
Gate Charge (qg) @ Vgs
10nC @ 10V
Input Capacitance (ciss) @ Vds
600pF @ 10V
Power - Max
45W
Mounting Type
Surface Mount
Package / Case
2-5Q1A
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.38 Ohms
Forward Transconductance Gfs (max / Min)
3.9 S
Drain-source Breakdown Voltage
200 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
5.5 A
Power Dissipation
45 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Gate Charge Qg
3.7 nC
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
100
2.5
0.1
1.5
0.5
10
3
2
1
1
0
0
1
I D max (Continuous)
I D max (Pulse) *
Curves
linearly
temperature.
*: Single pulse
Tc = 25°C
(1)
(2)
Ambient temperature Ta (°C)
Drain-source voltage V
must
with
DC Operation
40
Tc = 25°C
1000
100
Safe operating area
0.1
10
0.001
increase
be
1
10
(1) Device mounted on a glass-epoxy board (a) (Note 2a)
(2) Device mounted on a glass-epoxy board (b) (Note 2b)
(3) Tc=25℃
derated
P
D
80
– Ta
in
(1) Device mounted on a
(2) Device mounted on a
t =10s
glass-epoxy board (a)
(Note 2a)
glass-epoxy board (b)
(Note 2b)
V DSS max
0.01
t =1 ms *
100
DS
120
10 ms *
(V)
0.1
160
Pulse width t
1000
r
6
th
– t
1
w
w
(s)
60
40
20
0
10
0
Case temperature Tc (°C)
40
100
Single pulse
P
D
80
– Tc
(2)
(1)
(3)
1000
TPCA8010-H
120
2009-12-21
160

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