MT48LC4M32LFF5-8 IT:G TR Micron Technology Inc, MT48LC4M32LFF5-8 IT:G TR Datasheet - Page 35

DRAM Chip Mobile SDRAM 128M-Bit 4Mx32 3.3V 90-Pin VFBGA T/R

MT48LC4M32LFF5-8 IT:G TR

Manufacturer Part Number
MT48LC4M32LFF5-8 IT:G TR
Description
DRAM Chip Mobile SDRAM 128M-Bit 4Mx32 3.3V 90-Pin VFBGA T/R
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet

Specifications of MT48LC4M32LFF5-8 IT:G TR

Density
128 Mb
Maximum Clock Rate
125 MHz
Package
90VFBGA
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
19|8|7 ns
Operating Temperature
-40 to 85 °C
Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
128M (4Mx32)
Speed
125MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
90-VFBGA
Organization
4Mx32
Address Bus
14b
Access Time (max)
19/8/7ns
Operating Supply Voltage (typ)
3.3V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
115mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
WRITEs
Figure 20:
PDF: 09005aef807f4885/Source: 09005aef8071a76b
128Mbx16x32Mobile_2.fm - Rev. M 1/09 EN
WRITE Command
WRITE bursts are initiated with a WRITE command, as shown in Figure 20.
The starting column and bank addresses are provided with the WRITE command, and
auto precharge either is enabled or disabled for that access. If auto precharge is enabled,
the row being accessed is precharged at the completion of the burst. For the WRITE
commands used in the following illustrations, auto precharge is disabled.
During WRITE bursts, the first valid data-in element will be registered coincident with
the WRITE command. Subsequent data elements will be registered on each successive
positive clock edge. Upon completion of a fixed-length burst, assuming no other
commands have been initiated, the DQ will remain High-Z, and any additional input
data will be ignored (see Figure 21 on page 36). A full-page burst will continue until
terminated. (At the end of the page, it will wrap to column 0 and continue.)
x16: A0–A8
x32: A0–A7
Data for any WRITE burst may be truncated with a subsequent WRITE command, and
data for a fixed-length WRITE burst may be immediately followed by data for a WRITE
command. The new WRITE command can be issued on any clock following the previous
WRITE command, and the data provided coincident with the new command applies to
the new command. An example is shown in Figure 21 on page 36. Data n + 1 is either the
last of a burst of two or the last desired of a longer burst. The 128Mb SDRAM uses a pipe-
lined architecture and, therefore, does not require the 2n rule associated with a prefetch
architecture. A WRITE command can be initiated on any clock cycle following a previous
WRITE command. Full-speed random write accesses within a page can be performed to
the same bank, as shown in Figure 22 on page 36, or each subsequent WRITE may be
performed to a different bank.
A9, A11
BA0,1
RAS#
CAS#
WE#
CLK
CKE
A10
CS#
HIGH
VALID ADDRESS
DISABLE AUTO PRECHARGE
ENABLE AUTO PRECHARGE
ADDRESS
ADDRESS
COLUMN
BANK
35
DON’T CARE
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128Mb: x16, x32 Mobile SDRAM
©2001 Micron Technology, Inc. All rights reserved.
READs

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