PBRN113EK,115 NXP Semiconductors, PBRN113EK,115 Datasheet
PBRN113EK,115
Specifications of PBRN113EK,115
PBRN113EK T/R
PBRN113EK T/R
Related parts for PBRN113EK,115
PBRN113EK,115 Summary of contents
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PBRN113E series NPN 800 mA BISS RETs Rev. 01 — 1 March 2007 1. Product profile 1.1 General description 800 mA NPN low V Transistors (RET) family in small ...
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... NXP Semiconductors Table 2. Symbol I ORM R1 R2/R1 [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 2. Pinning information Table 3. Pin SOT54 SOT54A SOT54 variant SOT23; SOT346 PBRN113E_SER_1 Product data sheet NPN 800 mA BISS RETs Quick reference data …continued ...
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... NXP Semiconductors 3. Ordering information Table 4. Type number PBRN113EK PBRN113ES PBRN113ET [1] Also available in SOT54A and SOT54 variant packages (see 4. Marking Table 5. Type number PBRN113EK PBRN113ES PBRN113ET [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors Fig 2. Power derating curve for SOT54 (SC-43A/TO-92) 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on a ceramic PCB, Al ...
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... NXP Semiconductors th(j-a) 0.75 (K/W) 0.50 0. 0.20 0.10 0.05 10 0.02 0. FR4 PCB, standard footprint Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT23 (TO-236AB) and SOT346 (SC-59A/TO-236); typical values th(j- (K/W) 0.75 0. 0.33 0.20 0.10 0.05 10 0.02 ...
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... NXP Semiconductors th(j-a) (K/ 0. 0.50 0.33 0.20 0.10 0.05 10 0.02 0. Ceramic PCB standard footprint 2 3 Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT23 (TO-236AB) and SOT346 (SC-59A/TO-236); typical values th(j-a) (K/ 0. 0.50 0.33 0.20 0.10 10 0.05 ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol I CBO I CEO I EBO CEsat V I(off) V I(on) R1 R2/ [1] Pulse test: t PBRN113E_SER_1 Product data sheet NPN 800 mA BISS RETs Characteristics Parameter Conditions collector-base cut-off V CB current collector-emitter cut-off V CE current emitter-base cut-off V EB ...
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... NXP Semiconductors (1) ( 100 C amb ( amb ( amb Fig 7. DC current gain as a function of collector current; typical values 1 V CEsat (V) ( 100 C amb ( amb ( amb Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values PBRN113E_SER_1 Product data sheet NPN 800 mA BISS RETs ...
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... NXP Semiconductors 10 V I(on) (V) (1) ( amb ( amb ( 100 C amb Fig 11. On-state input voltage as a function of collector current; typical values PBRN113E_SER_1 Product data sheet NPN 800 mA BISS RETs 006aab008 10 V I(off) ( (mA (1) T amb (2) T amb (3) T amb Fig 12. Off-state input voltage as a function of collector current ...
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... NXP Semiconductors 8. Package outline 3.1 2.7 3 3.0 1.7 2.5 1.3 1 1.9 Dimensions in mm Fig 13. Package outline SOT346 (SC-59A/TO-236) 4.2 3.6 3 max 4.8 4.4 5.2 14.5 5.0 12.7 Dimensions in mm Fig 15. Package outline SOT54A Fig 17. Package outline SOT23 (TO-236AB) PBRN113E_SER_1 Product data sheet NPN 800 mA BISS RETs ...
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... NXP Semiconductors 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PBRN113EK PBRN113ES PBRN113ET [1] For further information and the availability of packing methods, see 10. Soldering Fig 18. Reflow soldering footprint SOT346 (SC-59A/TO-236) PBRN113E_SER_1 Product data sheet NPN 800 mA BISS RETs ...
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... NXP Semiconductors Fig 19. Wave soldering footprint SOT346 (SC-59A/TO-236) Fig 20. Reflow soldering footprint SOT23 (TO-236AB) PBRN113E_SER_1 Product data sheet NPN 800 mA BISS RETs 4.70 2.80 5.20 4.60 1.20 1 1.20 (2x) 3.40 preferred transport direction during soldering 2.90 2.50 0.85 2 3.00 1.30 0. ...
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... NXP Semiconductors 4.60 Fig 21. Wave soldering footprint SOT23 (TO-236AB) PBRN113E_SER_1 Product data sheet NPN 800 mA BISS RETs 3.40 1.20 (2x 4.00 1.20 3 2.80 4.50 Rev. 01 — 1 March 2007 PBRN113E series solder lands solder resist occupied area Dimensions in mm preferred transport direction during soldering sot023 © ...
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... NXP Semiconductors 11. Revision history Table 10. Revision history Document ID Release date PBRN113E_SER_1 20070301 PBRN113E_SER_1 Product data sheet NPN 800 mA BISS RETs Data sheet status Change notice Product data sheet - Rev. 01 — 1 March 2007 PBRN113E series Supersedes - © NXP B.V. 2007. All rights reserved. ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 12 Legal information ...