LAN91C111-NU Standard Microsystems (SMSC), LAN91C111-NU Datasheet - Page 126

LAN91C111-NU

Manufacturer Part Number
LAN91C111-NU
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of LAN91C111-NU

Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.465V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
128
Lead Free Status / RoHS Status
Compliant

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Chapter 15 Package Outlines
Revision 1.91 (06-01-09)
A
A1
A2
D
D/2
E
E/2
E1
H
L
L1
e
q
W
R1
R2
ccc
ccc
D1
MIN
~
0.05
0.95
15.80
7.90
13.80
15.80
7.90
13.80
0.09
0.45
~
0.40 Basic
0
0.13
0.08
0.08
~
~
o
Notes:
1. Controlling Unit: millimeter
2. Tolerance on the position of the leads is ± 0.035 mm maximum
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
6. Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.
Maximum mold protrusion is 0.25 mm
Figure 15.1 128 Pin TQFP Package Outline, 14X14X1.0 Body
~
1.00
8.00
8.00
~
0.60
0.18
~
~
~
~
NOMINAL
~
16.00
14.00
16.00
14.00
1.00
~
Table 15.1 128 Pin TQFP Package Parameters
MAX
1.20
0.15
1.05
16.20
8.10
14.20
16.20
8.10
14.20
0.20
0.75
~
7
0.23
~
0.20
0.0762
0.08
o
DATASHEET
126
REMARK
Overall Package Height
Standoff
Body Thickness
X Span
1
X body Size
Y Span
1
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
/
/
2
2
X Span Measure from Centerline
Y Span Measure from Centerline
10/100 Non-PCI Ethernet Single Chip MAC + PHY
SMSC LAN91C111 REV C
Datasheet

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