XCF02SVOG20C Xilinx Inc, XCF02SVOG20C Datasheet - Page 13

PROM, PLATFORM FLASH, 2MBIT, 20TSSOP

XCF02SVOG20C

Manufacturer Part Number
XCF02SVOG20C
Description
PROM, PLATFORM FLASH, 2MBIT, 20TSSOP
Manufacturer
Xilinx Inc
Datasheet

Specifications of XCF02SVOG20C

Memory Type
Flash
Memory Size
2Mbit
Clock Frequency
50MHz
Supply Voltage Range
2.3V To 2.7V, 3V To 3.6V
Memory Case Style
TSSOP
No. Of Pins
20
Operating Temperature Range
-40°C To +85°
Programmable Type
In System Programmable
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
20-TSSOP (0.173", 4.40mm Width)
Interface Type
Serial, Parallel, JTAG
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1287-5

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DC Electrical Characteristics
Absolute Maximum Ratings
Supply Voltage Requirements for Power-On Reset and Power-Down
DS123 (v2.18) May 19, 2010
Product Specification
Notes:
1.
2.
3.
Notes:
1.
2.
3.
V
V
V
V
V
T
T
T
V
T
V
T
STG
J
VCC
OER
RST
CCINT
CCO
CCJ
IN
TS
CCPOR
CCPD
Symbol
Symbol
Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the device
pins can undershoot to –2.0V or overshoot to +7.0V, provided this overshoot or undershoot lasts less then 10 ns and with the forcing current
being limited to 200 mA.
Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time adversely affects device reliability.
For soldering guidelines, see the information on "Packaging and Thermal Characteristics" at
V
At power up, the device requires the V
time. If the power supply cannot meet this requirement, then the device might not perform power-on-reset properly. See
If the V
then the configuration data from the PROM is not available at the recommended threshold levels. The configuration sequence must be
delayed until both V
CCINT
, V
CCINT
R
CCO
Internal supply voltage relative to GND
I/O supply voltage relative to GND
JTAG I/O supply voltage relative to GND
Input voltage with respect to GND
Voltage applied to High-Z output
Storage temperature (ambient)
Junction temperature
V
POR threshold for the V
OE/RESET release delay following POR
Power-down threshold for V
Time required to trigger a device reset when the V
supply drops below the maximum V
CCINT
and V
, and V
rise time from 0V to nominal voltage
CCO
CCINT
CCJ
supplies do not reach their respective recommended operating conditions before the OE/RESET pin is released,
supplies can be applied in any order.
and V
CCO
Description
Description
CCINT
have reached their recommended operating conditions.
CCINT
CCINT
supply
power supply to monotonically rise to the nominal operating voltage within the specified T
supply
CCPD
(3)
V
V
V
V
threshold
CCO
CCO
CCO
CCO
(2)
www.xilinx.com
Platform Flash In-System Programmable Configuration PROMs
< 2.5V
≥ 2.5V
< 2.5V
≥ 2.5V
CCINT
XCF01S, XCF02S,
XCF01S, XCF02S,
Min
0.2
0.5
10
1
–0.5 to +4.0
–0.5 to +4.0
–0.5 to +4.0
–0.5 to +3.6
–0.5 to +5.5
–0.5 to +3.6
–0.5 to +5.5
–65 to +150
XCF04S
XCF04S
+125
Max
50
3
1
www.xilinx.com.
XCF08P, XCF16P,
XCF08P, XCF16P,
Min
0.2
0.5
0.5
10
–0.5 to +2.7
–0.5 to +4.0
–0.5 to +4.0
–0.5 to +3.6
–0.5 to +3.6
–0.5 to +3.6
–0.5 to +3.6
–65 to +150
XCF32P
XCF32P
+125
Max
Figure 6, page
0.5
50
30
VCC
Units
Units
ms
ms
ms
°C
°C
V
V
V
V
V
V
V
V
V
11.
rise
13

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