PIC24F04KA201T-I/SS Microchip Technology, PIC24F04KA201T-I/SS Datasheet - Page 188
![PIC24F Core, 4KB Flash, 512B RAM, 3V, Deep Sleep, 10-bit 500ksps ADC, CTMU, UART](/photos/6/81/68119/150-28-ssop_sml.jpg)
PIC24F04KA201T-I/SS
Manufacturer Part Number
PIC24F04KA201T-I/SS
Description
PIC24F Core, 4KB Flash, 512B RAM, 3V, Deep Sleep, 10-bit 500ksps ADC, CTMU, UART
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr
Datasheets
1.PIC24F04KA201-ISS.pdf
(8 pages)
2.PIC24F04KA201-ISS.pdf
(48 pages)
3.PIC24F04KA201-ISS.pdf
(224 pages)
4.PIC24F04KA201-ISS.pdf
(26 pages)
Specifications of PIC24F04KA201T-I/SS
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
18
Program Memory Size
4KB (1.375K x 24)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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PIC24F04KA201 FAMILY
26.1
FIGURE 26-1:
TABLE 26-1:
TABLE 26-2:
DS39937B-page 186
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 14-Pin PDIP
Package Thermal Resistance, 20-Pin PDIP
Package Thermal Resistance, 14-Pin SSOP
Package Thermal Resistance, 20-Pin SSOP
Package Thermal Resistance, 14-Pin SOIC
Package Thermal Resistance, 20-Pin SOIC
Package Thermal Resistance, 14-Pin QFN
Package Thermal Resistance, 20-Pin QFN
Note 1:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Note:
DC Characteristics
P
P
INT
I
/
O
Junction to ambient thermal resistance, Theta-
= Σ ({V
= V
For frequencies between 8 MHz and 32 MHz, F
3.60V
3.00V
1.80V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
x (I
DD
PIC24F04KA201 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
DD
– V
Characteristic
– Σ I
OH
} x I
Rating
OH
OH
)
) + Σ (V
8 MHz
OL
x I
OL
Preliminary
)
Frequency
JA
(θ
JA
MAX
) numbers are achieved by package simulations.
= 20 MHz *(V
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
θ
θ
P
T
T
JA
JA
JA
JA
JA
JA
JA
JA
A
D
J
62.4
80.2
Min
Typ
108
-40
-40
DD
60
71
75
43
32
– 1.8) + 8 MHz.
(T
© 2009 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
—
—
—
—
32 MHz
+ P
A
)/θ
I
/
O
JA
3.00V
3.60V
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1
1
1
1
1
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