PIC24F04KA201T-I/SS Microchip Technology, PIC24F04KA201T-I/SS Datasheet - Page 20
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PIC24F04KA201T-I/SS
Manufacturer Part Number
PIC24F04KA201T-I/SS
Description
PIC24F Core, 4KB Flash, 512B RAM, 3V, Deep Sleep, 10-bit 500ksps ADC, CTMU, UART
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr
Datasheets
1.PIC24F04KA201-ISS.pdf
(8 pages)
2.PIC24F04KA201-ISS.pdf
(48 pages)
3.PIC24F04KA201-ISS.pdf
(224 pages)
4.PIC24F04KA201-ISS.pdf
(26 pages)
Specifications of PIC24F04KA201T-I/SS
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
18
Program Memory Size
4KB (1.375K x 24)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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PIC24F04KA201 FAMILY
2.6
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
Section 8.0 “Oscillator Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator
circuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a
two-sided board, avoid any traces on the other side of
the board where the crystal is placed. A suggested
layout is shown in Figure 2-4.
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
• AN826, “Crystal Oscillator Basics and Crystal
• AN849, “Basic PICmicro
• AN943, “Practical PICmicro
• AN949, “Making Your Oscillator Work”
FIGURE 2-4:
DS39937B-page 18
Selection for rfPIC™ and PICmicro
and Design”
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
External Oscillator Pins
secondary
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
®
Oscillator Design”
®
oscillator
Oscillator Analysis
®
Devices”
(refer
13
14
15
16
17
18
19
20
Preliminary
to
2.7
If the MPLAB ICD 2, ICD 3 or REAL ICE emulator is
selected as a debugger, it automatically initializes all of
the A/D input pins (ANx) as “digital” pins by setting all
bits in the AD1PCFGL register.
The bits in this register that correspond to the A/D pins
that are initialized by the MPLAB ICD 2, ICD 3 or REAL
ICE emulator must not be cleared by the user
application firmware; otherwise, communication errors
will result between the debugger and the device.
If your application needs to use certain A/D pins as
analog input pins during the debug session, the user
application must clear the corresponding bits in the
AD1PCFGL register during initialization of the ADC
module.
When the MPLAB ICD 2, ICD 3 or REAL ICE emulator
is used as a programmer, the user application firmware
must correctly configure the AD1PCFGL register.
Automatic initialization of this register is only done
during debugger operation. Failure to correctly
configure the register(s) will result in all A/D pins being
recognized as analog input pins, resulting in the port
value being read as a logic ‘0’, which may affect user
application functionality.
2.8
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 kΩ
to 10 kΩ resistor to V
output to logic low.
Configuration of Analog and
Digital Pins During ICSP
Operations
Unused I/Os
SS
© 2009 Microchip Technology Inc.
on unused pins and drive the
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