PIC24F08KA102-E/ML Microchip Technology, PIC24F08KA102-E/ML Datasheet - Page 214
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PIC24F08KA102-E/ML
Manufacturer Part Number
PIC24F08KA102-E/ML
Description
8KB Flash, 1.5KB RAM, 512B EEPROM, 16 MIPS, 24 I/O,16-bit PIC24F Family, NanoWat
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr
Datasheet
1.MA240017.pdf
(254 pages)
Specifications of PIC24F08KA102-E/ML
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
8KB (2.75K x 24)
Program Memory Type
FLASH
Eeprom Size
512 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Processor Series
PIC24F
Core
PIC
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM240001
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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PIC24F16KA102 FAMILY
29.1
FIGURE 29-1:
TABLE 29-1:
TABLE 29-2:
DS39927B-page 212
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 20-Pin PDIP
Package Thermal Resistance, 28-Pin SPDIP
Package Thermal Resistance, 20-Pin SSOP
Package Thermal Resistance, 28-Pin SSOP
Package Thermal Resistance, 20-Pin SOIC
Package Thermal Resistance, 28-Pin SOIC
Package Thermal Resistance, 20-Pin QFN
Package Thermal Resistance, 28-Pin QFN
Note 1:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Note:
DC Characteristics
P
P
INT
I
/
O
Junction to ambient thermal resistance, Theta-
= Σ ({V
= V
For frequencies between 8 MHz and 32 MHz, F
3.60V
3.00V
1.80V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
x (I
DD
PIC24F16KA102 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
DD
– V
Characteristic
– Σ I
OH
} x I
Rating
OH
OH
)
) + Σ (V
8 MHz
OL
x I
OL
Preliminary
)
Frequency
JA
(θ
JA
MAX
) numbers are achieved by package simulations.
= 20 MHz *(V
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
θ
θ
P
T
T
JA
JA
JA
JA
JA
JA
JA
JA
A
D
J
62.4
80.2
Min
Typ
108
-40
-40
DD
60
71
75
43
32
– 1.8) + 8 MHz.
(T
© 2009 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
—
—
—
—
32 MHz
+ P
A
)/θ
I
/
O
JA
3.00V
3.60V
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1
1
1
1
1
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