TZA3044TT/C2 NXP Semiconductors, TZA3044TT/C2 Datasheet - Page 10

• Manufacturer Part Number: TZA3044TT/C2
• Manufacturer: NXP Semiconductors

Specifications of TZA3044TT/C2

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Lead Free Status / RoHS Status: Not Compliant

Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. For the TZA3044B the minimum value is 0.5 V for ST and STQ outputs.
HANDLING
This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through
electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can
be obtained by bonding the V
connections in any order.
THERMAL CHARACTERISTICS
Note
1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided
2002 Jul 19
V
V
I
P
T
T
T
R
n
SYMBOL
stg
j
amb
SYMBOL
CC
n
tot
th(j-a)
SDH/SONET STM4/OC12 and 1.25
Gbits/s Gigabit Ethernet postamplifiers
57
in still air.
57
1.6 mm FR4 epoxy printed-circuit board with 35 m thick copper traces. The measurements are performed
supply voltage
DC voltage
DC current
total power dissipation
storage temperature
junction temperature
ambient temperature
thermal resistance from junction to ambient
pins DIN, DINQ, CF, JAM and RSET
pins ST, STQ, DOUT and DOUTQ
pin V
pins DIN, DINQ, CF and JAM
pins ST, STQ, DOUT and DOUTQ
pin V
pin RSET
SO16 package
TSSOP16 package
ref
ref
CC
PARAMETER
PARAMETER
and GND pads first, the remaining pads may then be bonded to their external
10
note 1
note 1
CONDITIONS
CONDITIONS
V
0.5
0.5
0.5
1
25
2
2
65
40
CC
TZA3044; TZA3044B
MIN.
VALUE
2
115
150
+6
V
V
+3.2
+1
+10
+2.5
+2
300
+150
150
+85
CC
CC
MAX.
Product specification
+ 0.5
+ 0.5
UNIT
V
V
V
V
mA
mA
mA
mA
mW
K/W
K/W
C
C
C
UNIT