TZA3044TT/C2 NXP Semiconductors, TZA3044TT/C2 Datasheet - Page 23

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TZA3044TT/C2

Manufacturer Part Number
TZA3044TT/C2
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TZA3044TT/C2

Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Package Type
TSSOP
Lead Free Status / RoHS Status
Not Compliant
Philips Semiconductors
2002 Jul 19
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SDH/SONET STM4/OC12 and 1.25
Gbits/s Gigabit Ethernet postamplifiers
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT403-1
max.
1.10
A
0.15
0.05
A
1
16
1
0.95
0.80
A
2
y
IEC
Z
0.25
pin 1 index
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
9
8
D
5.1
4.9
0
(1)
w
E
4.5
4.3
M
(2)
scale
EIAJ
2.5
0.65
23
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
1.0
L
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
TZA3044; TZA3044B
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
Product specification
X
v
0.1
A
y
M
ISSUE DATE
A
95-04-04
99-12-27
0.40
0.06
Z
(1)
SOT403-1
8
0
o
o

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