TZA3044TT/C2 NXP Semiconductors, TZA3044TT/C2 Datasheet - Page 20

• Manufacturer Part Number: TZA3044TT/C2
• Manufacturer: NXP Semiconductors

Specifications of TZA3044TT/C2

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Lead Free Status / RoHS Status: Not Compliant

Philips Semiconductors
BONDING PADS
2002 Jul 19
SUB
TEST
AGND
AGND
n.c.
AGND
DIN
DINQ
AGND
TEST
V
V
CF
SUB
TEST
JAM
STQ
ST
DGND
DGND
TEST
SYMBOL
CCA
CCA
SDH/SONET STM4/OC12 and 1.25
Gbits/s Gigabit Ethernet postamplifiers
PAD
10
11
12
13
14
15
16
17
18
19
20
21
1
2
3
4
5
6
7
8
9
+218.5
+375.6
+532.7
+647.8
+647.8
+61.4
235.7
392.8
532.8
647.8
647.8
647.8
647.8
647.8
647.8
647.8
647.8
532.8
392.8
235.7
COORDINATES
78.6
X
+647.8
+647.8
+647.8
+507.1
+350.0
+210.0
+70.0
210.0
350.0
507.1
647.8
647.8
647.8
647.8
647.8
647.8
647.8
647.8
507.1
350.0
70.0
Y
(1)
20
Note
1. The x and y coordinates represent the position of the
DGND
DOUTQ
DOUT
DGND
TEST
V
V
V
RSET
n.c.
n.c.
CCD
CCD
ref
SYMBOL
centre of the pad with respect to the centre of the die
(see Fig.27).
PAD
22
23
24
25
26
27
28
29
30
31
32
TZA3044; TZA3044B
+647.8
+647.8
+647.8
+647.8
+647.8
+647.8
+532.7
+392.7
+235.6
+78.5
COORDINATES
78.6
X
Product specification
+210.0
+350.0
+507.1
+647.8
+647.8
+647.8
+647.8
+647.8
+70.0
210.0
70.0
Y
(1)