TZA3044TT/C2 NXP Semiconductors, TZA3044TT/C2 Datasheet - Page 21

• Manufacturer Part Number: TZA3044TT/C2
• Manufacturer: NXP Semiconductors

Specifications of TZA3044TT/C2

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Lead Free Status / RoHS Status: Not Compliant

Philips Semiconductors
Physical characteristics of bare die
2002 Jul 19
handbook, full pagewidth
Glass passivation
Bonding pad dimension
Metallization
Thickness
Size
Backing
Attache temperature
Attache time
SDH/SONET STM4/OC12 and 1.25
Gbits/s Gigabit Ethernet postamplifiers
(1) Typical value.
PARAMETER
1.55
mm
Fig.27 Bonding pad locations of TZA3044U and TZA3044BU.
2.1 m PSG (PhosphoSilicate Glass) on top of 0.65 m oxynitride
minimum dimension of exposed metallization is 90
1.22 m W/AlCu/TiW
380 m nominal
1.55
silicon; electrically connected to GND potential through substrate contacts
<440 C; recommended die attache is glue
<15 s
(1)
AGND
AGND
AGND
V CCA
DINQ
TEST
DIN
n.c.
1.55 mm (2.4 mm
10
11
4
5
6
7
8
9
12
3
13
2
2
14
1
)
x
TZA3044BU
TZA3044U
1.55
21
15
32
0
y
0
(1)
16
31
mm
17
30
VALUE
18
29
28
19
MGR242
27
26
25
24
23
22
21
20
90 m (pad size = 100
TZA3044; TZA3044B
V CCD
TEST
DGND
DOUT
DOUTQ
DGND
TEST
DGND
Product specification
100 m)