LTC4225CGN-1#TRPBF Linear Technology, LTC4225CGN-1#TRPBF Datasheet - Page 22
LTC4225CGN-1#TRPBF
Manufacturer Part Number
LTC4225CGN-1#TRPBF
Description
Manufacturer
Linear Technology
Datasheet
1.LTC4225CGN-1TRPBF.pdf
(24 pages)
Specifications of LTC4225CGN-1#TRPBF
Lead Free Status / RoHS Status
Compliant
LTC4225-1/LTC4225-2
package DescripTion
22
4.50 ± 0.05
3.10 ± 0.05
2.00 REF
5.00 ± 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.65 ± 0.05
PIN 1
TOP MARK
(NOTE 6)
0.50 BSC
0.25 ±0.05
3.65 ± 0.05
4.10 ± 0.05
5.50 ± 0.05
4.00 ± 0.10
(2 SIDES)
3.00 REF
(Reference LTC DWG # 05-08-1696 Rev A)
24-Lead Plastic QFN (4mm × 5mm)
UFD Package
0.70 ±0.05
0.75 ± 0.05
PACKAGE OUTLINE
0.200 REF
0.00 – 0.05
3.00 REF
R = 0.05 TYP
BOTTOM VIEW—EXPOSED PAD
3.65 ± 0.10
2.65 ± 0.10
2.00 REF
R = 0.115
TYP
23
24
R = 0.20 OR C = 0.35
0.50 BSC
0.25 ± 0.05
PIN 1 NOTCH
(UFD24) QFN 0506 REV A
1
2
0.40 ± 0.10
422512f