MT47H128M16RT-25E:C Micron Technology Inc, MT47H128M16RT-25E:C Datasheet - Page 21

• Manufacturer Part Number: MT47H128M16RT-25E:C
• Description: DRAM Chip DDR2 SDRAM 2G-Bit 128Mx16 1.8V 84-Pin FBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr
• Series: -r

Specifications of MT47H128M16RT-25E:C

• Package: 84FBGA
• Density: 2 Gb
• Address Bus Width: 17 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Clock Rate: 800 MHz
• Maximum Random Access Time: 0.4 ns
• Operating Temperature: 0 to 70 °C
• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 2G (128M x 16)
• Speed: 2.5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Package / Case: 84-TFBGA
• Lead Free Status / RoHS Status: Compliant

Figure 10: 60-Ball FBGA Package (11.5mm x 14mm) – x4, x8
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. E 06/10 EN
Solder ball
material: SAC305.
Dimensions
apply to solder
balls post-reflow
on Ø0.33 NSMD
ball pads.
Seating
60X Ø0.45
plane
0.12 A
8 CTR
0.8 TYP
A
Notes:
9 8 7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
0.8 TYP
11.5 ±0.15
6.4 CTR
3 2 1
A
B
C
D
E
F
G
H
J
K
L
0.8 ±0.1
21
Ball A1 ID
14 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
2Gb: x4, x8, x16 DDR2 SDRAM
1.2 MAX
Ball A1 ID
© 2006 Micron Technology, Inc. All rights reserved.
Packaging