MT49H32M9BM-25 Micron Technology Inc, MT49H32M9BM-25 Datasheet - Page 30

• Manufacturer Part Number: MT49H32M9BM-25
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H32M9BM-25

• Organization: 32Mx9
• Density: 288Mb
• Address Bus: 22b
• Maximum Clock Rate: 400MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: uBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 779mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Table 15:
Figure 11:
PDF: 09005aef80a41b59/Source: 09005aef809f284b
288Mb_RLDRAM_II_CIO_D2.fm - Rev N 5/08 EN
Package
µBGA
FBGA
Thermal Impedance
Example Temperature Test Point Location
Substrate
2-layer
4-layer
2-layer
4-layer
Notes: Thermal impedance data is based on a number of samples from multiple lots and should be
Test point
viewed as a typical number.
Airflow = 0m/s
θ JA (°C/W)
288Mb: x9, x18, x36 2.5V V
41.2
28.2
42.2
28.5
11.00
5.50
Airflow = 1m/s
θ JA (°C/W)
29.1
21.9
29.3
22.0
30
9.25
18.50
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Temperature and Thermal Impedance
EXT
Airflow = 2m/s
θ JA (°C/W)
, 1.8V V
25.3
19.9
25.3
19.9
DD
, HSTL, CIO, RLDRAM II
©2003 Micron Technology, Inc. All rights reserved.
θ JB (°C/W)
14.3
13.6
16.4
13.4
θ JC (°C/W)
2.27
2.6