MT49H32M9BM-25 Micron Technology Inc, MT49H32M9BM-25 Datasheet - Page 75

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MT49H32M9BM-25

Manufacturer Part Number
MT49H32M9BM-25
Description
Manufacturer
Micron Technology Inc
Type
RLDRAMr
Datasheet

Specifications of MT49H32M9BM-25

Organization
32Mx9
Density
288Mb
Address Bus
22b
Maximum Clock Rate
400MHz
Operating Supply Voltage (typ)
1.8V
Package Type
uBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
779mA
Pin Count
144
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT49H32M9BM-25
Manufacturer:
MICRON/美光
Quantity:
20 000
Part Number:
MT49H32M9BM-25:B
Manufacturer:
MICRON/美光
Quantity:
20 000
Company:
Part Number:
MT49H32M9BM-25:B
Quantity:
260
Table 28:
Table 29:
PDF: 09005aef80a41b59/Source: 09005aef809f284b
288Mb_RLDRAM_II_CIO.Core.fm - Rev B 5/08 EN
Instruction
Extest
ID code
Sample/preload
Clamp
High-Z
Bypass
Bit#
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
2
3
4
5
6
7
8
9
Instruction Codes
Boundary Scan (Exit) Order
0000 0000
0010 0001
0000 0101
0000 0111
0000 0011
1111 1111
Code
Ball
U10
U10
U11
U11
M1
M3
M2
K1
K2
N1
N3
N3
N2
N2
U2
U2
U3
U3
V2
P1
P3
P3
P2
P2
R2
R3
T2
T2
T3
T3
L2
L1
288Mb: x9, x18, x36 2.5V V
Captures I/O ring contents; Places the boundary scan register between TDI and TDO;
This operation does not affect RLDRAM operations
Loads the ID register with the vendor ID code and places the register between TDI and
TDO; This operation does not affect RLDRAM operations
Captures I/O ring contents; Places the boundary scan register between TDI and TDO
Selects the bypass register to be connected between TDI and TDO; Data driven by
output balls are determined from values held in the boundary scan register
Selects the bypass register to be connected between TDI and TDO; All outputs are
forced into High-Z
Places the bypass register between TDI and TDO; This operation does not affect
RLDRAM operations
Bit#
39
40
41
42
43
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
44
74
IEEE 1149.1 Serial Boundary Scan (JTAG)
Ball
M11
M10
M12
N11
N11
N10
N10
N12
H11
H12
G12
G10
G11
R11
R11
K11
K12
P11
P11
P10
P10
P12
L12
L11
E12
F12
F10
F10
F11
F11
J12
J11
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Description
EXT
, 1.8V V
DD
Bit#
100
101
102
103
104
105
106
107
108
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
, HSTL, CIO, RLDRAM II
©2003 Micron Technology, Inc. All rights reserved.
Ball
C11
C11
C10
C10
B11
B11
B10
B10
D3
D3
D2
D2
G2
G3
B3
B3
B2
B2
C3
C3
C2
C2
E2
E2
E3
E3
F2
F2
F3
F3
E1
F1

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