MC9S08QD2CSC Freescale, MC9S08QD2CSC Datasheet - Page 81

MC9S08QD2CSC

Manufacturer Part Number
MC9S08QD2CSC
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S08QD2CSC

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
8MHz
Total Internal Ram Size
128Byte
# I/os (max)
4
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
4-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
SOIC N
Program Memory Type
Flash
Program Memory Size
2KB
Lead Free Status / RoHS Status
Compliant

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0
Chapter 7 Central Processor Unit (S08CPUV2)
7.4.5
BGND Instruction
The BGND instruction is new to the HCS08 compared to the M68HC08. BGND would not be used in
normal user programs because it forces the CPU to stop processing user instructions and enter the active
background mode. The only way to resume execution of the user program is through reset or by a host
debug system issuing a GO, TRACE1, or TAGGO serial command through the background debug
interface.
Software-based breakpoints can be set by replacing an opcode at the desired breakpoint address with the
BGND opcode. When the program reaches this breakpoint address, the CPU is forced to active
background mode rather than continuing the user program.
MC9S08QD4 Series MCU Data Sheet, Rev. 6
Freescale Semiconductor
81

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