MC9S08QG8CDTER Freescale, MC9S08QG8CDTER Datasheet - Page 19

• Manufacturer Part Number: MC9S08QG8CDTER
• Manufacturer: Freescale

Specifications of MC9S08QG8CDTER

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Program Memory Type: Flash
• Program Memory Size: 8KB
• Lead Free Status / RoHS Status: Compliant

Section Number
17.3 On-Chip Debug System (DBG) .................................................................................................... 252
17.4 Register Definition ........................................................................................................................ 256
A.1 Introduction ....................................................................................................................................265
A.2 Absolute Maximum Ratings...........................................................................................................265
A.3 Thermal Characteristics..................................................................................................................266
A.4 ESD Protection and Latch-Up Immunity .......................................................................................268
A.5 DC Characteristics..........................................................................................................................269
A.6 Supply Current Characteristics.......................................................................................................272
A.7 External Oscillator (XOSC) and Internal Clock Source (ICS) Characteristics..............................274
A.8 AC Characteristics..........................................................................................................................276
A.9 Analog Comparator (ACMP) Electricals .......................................................................................282
A.10 ADC Characteristics.......................................................................................................................282
A.11 FLASH Specifications....................................................................................................................285
A.12 EMC Performance..........................................................................................................................286
B.1 Ordering Information .....................................................................................................................289
B.2 Mechanical Drawings.....................................................................................................................289
Freescale Semiconductor
17.2.4 BDC Hardware Breakpoint..............................................................................................251
17.3.1 Comparators A and B ......................................................................................................252
17.3.2 Bus Capture Information and FIFO Operation ................................................................252
17.3.3 Change-of-Flow Information ...........................................................................................253
17.3.4 Tag vs. Force Breakpoints and Triggers ..........................................................................253
17.3.5 Trigger Modes..................................................................................................................254
17.3.6 Hardware Breakpoints .....................................................................................................256
17.4.1 BDC Registers and Control Bits ......................................................................................256
17.4.2 System Background Debug Force Reset Register (SBDFR)...........................................258
17.4.3 DBG Registers and Control Bits......................................................................................259
A.8.1 Control Timing ................................................................................................................276
A.8.2 TPM/MTIM Module Timing ...........................................................................................277
A.8.3 SPI Timing .......................................................................................................................278
A.12.1 Radiated Emissions..........................................................................................................286
A.12.2 Conducted Transient Susceptibility .................................................................................286
B.1.1 Device Numbering Scheme .............................................................................................289
Ordering Information and Mechanical Drawings
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Electrical Characteristics
Appendix A
Appendix B
Title
Page
17