MC9S08QG8CDTER Freescale, MC9S08QG8CDTER Datasheet - Page 35

no-image

MC9S08QG8CDTER

Manufacturer Part Number
MC9S08QG8CDTER
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S08QG8CDTER

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
20MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
512Byte
# I/os (max)
12
Number Of Timers - General Purpose
1
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Package Type
TSSOP
Program Memory Type
Flash
Program Memory Size
8KB
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08QG8CDTER
0
Chapter 3
Modes of Operation
3.1
The operating modes of the MC9S08QG8/4 are described in this section. Entry into each mode, exit from
each mode, and functionality while in each mode are described.
3.2
3.3
Run is the normal operating mode for the MC9S08QG8/4. This mode is selected upon the MCU exiting
reset if the BKGD/MS pin is high. In this mode, the CPU executes code from internal memory with
execution beginning at the address fetched from memory at 0xFFFE:0xFFFF after reset.
3.4
The active background mode functions are managed through the background debug controller (BDC) in
the HCS08 core. The BDC, together with the on-chip debug module (DBG), provides the means for
analyzing MCU operation during software development.
Active background mode is entered in any of five ways:
Freescale Semiconductor
Active background mode for code development
Wait mode:
— CPU halts operation to conserve power
— System clocks running
— Full voltage regulation is maintained
Stop modes: CPU and bus clocks stopped
— Stop1: Full powerdown of internal circuits for maximum power savings
— Stop2: Partial powerdown of internal circuits; RAM contents retained
— Stop3: All internal circuits powered for fast recovery; RAM and register contents are retained
When the BKGD/MS pin is low during POR or immediately after issuing a background debug
force reset (see
When a BACKGROUND command is received through the BKGD pin
When a BGND instruction is executed
When encountering a BDC breakpoint
When encountering a DBG breakpoint
Introduction
Features
Run Mode
Active Background Mode
5.8.3, “System Background Debug Force Reset Register
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
(SBDFR)”)
33

Related parts for MC9S08QG8CDTER