MC9S08QG8CDTER Freescale, MC9S08QG8CDTER Datasheet - Page 251
MC9S08QG8CDTER
Manufacturer Part Number
MC9S08QG8CDTER
Description
Manufacturer
Freescale
Datasheet
1.MC9S08QG8CDTER.pdf
(314 pages)
Specifications of MC9S08QG8CDTER
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
20MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
512Byte
# I/os (max)
12
Number Of Timers - General Purpose
1
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Package Type
TSSOP
Program Memory Type
Flash
Program Memory Size
8KB
Lead Free Status / RoHS Status
Compliant
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WBKP
WD16
RBKP
RD16
WD
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Commands begin with an 8-bit hexadecimal command code in the host-to-target
direction (most significant bit first)
separates parts of the command
delay 16 target BDC clock cycles
8 bits of read data in the target-to-host direction
16 bits of read data in the target-to-host direction
16 bits of write data in the host-to-target direction
the contents of BDCSCR in the target-to-host direction (STATUS)
16 bits of read data in the target-to-host direction (from BDCBKPT breakpoint
register)
16 bits of write data in the host-to-target direction (for BDCBKPT breakpoint register)
a 16-bit address in the host-to-target direction
8 bits of write data in the host-to-target direction
8 bits of write data for BDCSCR in the host-to-target direction (CONTROL)
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Development Support
249
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