LC5512MV-75F256C LATTICE SEMICONDUCTOR, LC5512MV-75F256C Datasheet - Page 6

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LC5512MV-75F256C

Manufacturer Part Number
LC5512MV-75F256C
Description
CPLD ispXPLD™ 5000MV Family 150K Gates 512 Macro Cells 150MHz EECMOS Technology 3.3V 256-Pin FBGA
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet

Specifications of LC5512MV-75F256C

Package
256FBGA
Family Name
ispXPLD™ 5000MV
Device System Gates
150000
Number Of Macro Cells
512
Maximum Propagation Delay Time
7.5 ns
Number Of User I/os
193
Typical Operating Supply Voltage
3.3 V
Maximum Operating Frequency
150 MHz
Number Of Product Terms Per Macro
160
Ram Bits
262144
Memory Type
EEPROM/SRAM
Operating Temperature
0 to 90 °C

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Price
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LC5512MV-75F256C
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Lattice Semiconductor
Figure 1. ispXPLD 5000MX Block Diagram
Introduction
The ispXPLD 5000MX family represents a new class of device, referred to as the eXpanded Programmable Logic
Devices (XPLDs). These devices extend the capability of Lattice’s popular SuperWIDE ispMACH 5000 architecture
by providing flexible memory capability. The family supports single- or dual-port SRAM, FIFO, and ternary CAM
operation. Extra logic has also been included to allow efficient implementation of arithmetic functions. In addition,
sysCLOCK PLLs and sysIO interfaces provide support for the system-level needs of designers.
The devices provide designers with a convenient one-chip solution that provides logic availability at boot-up, design
security, and extreme reconfigurability. The use of advanced process technology provides industry-leading perfor-
mance with combinatorial propagation delay as low as 4.0ns, 2.8ns clock-to-out delay, 2.2ns set-up time, and oper-
ating frequency up to 300MHz. This performance is coupled with low static and dynamic power consumption. The
ispXPLD 5000MX architecture provides predictable deterministic timing.
The availability of 3.3, 2.5 and 1.8V versions of these devices along with the flexibility of the sysIO interface helps
users meet the challenge of today’s mixed voltage designs. Inputs can be safely driven up to 5.5V when an I/O
bank is configured for 3.3V operation, making this family 5V tolerant. Boundary scan testability further eases inte-
gration into today’s complex systems. A variety of density and package options increase the likelihood of a good fit
for a particular application. Table 1 shows the members of the ispXPLD 5000MX family.
Architecture
The ispXPLD 5000MX devices consist of Multi-Function Blocks (MFBs) interconnected with a Global Routing Pool.
Signals enter and leave the device via one of four sysIO banks. Figure 1 shows the block diagram of the ispXPLD
sysCONFIG
GCLCK0
Interface
Optional
GCLK1
GNDP
V
V
V
V
V
CCO0
CCO1
REF0
REF1
CCP
Bank 0
Bank 1
sysIO
sysIO
sysCLOCK
PLL 0
ISP Port
MFB
MFB
MFB
MFB
Routing
Global
(GRP)
2
Pool
ispXPLD 5000MX Family Data Sheet
MFB
MFB
MFB
MFB
sysCLOCK
PLL 1
Bank 3
Bank 2
sysIO
sysIO
V
GCLCK3
GCLK2
RESET
V
GOE0
GOE1
V
V
CCO3
REF3
REF2
CCO2

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