MT45W1ML16PAFA-70 WT Micron Technology Inc, MT45W1ML16PAFA-70 WT Datasheet - Page 24

• Manufacturer Part Number: MT45W1ML16PAFA-70 WT
• Manufacturer: Micron Technology Inc

Specifications of MT45W1ML16PAFA-70 WT

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

NOTE:
Data Sheet Designation: ADVANCE
ucts still in development.
09005aef80d481d3
AsyncCellularRAM_16_32.fm - Rev. A 2/18/04 EN
1. All dimensions in millimeters, MAX/MIN or typical where noted.
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS Ø0.35.
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
SEATING PLANE
This data sheet contains initial descriptions of prod-
CellularRAM is a trademark of Micron Technology, Inc. inside the U.S. and a trademark of Infineon Technologies outside the U.S.
5.25
48X Ø0.35
0.10 C
2.625 ±0.05
BALL A6
0.70 ±0.05
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
Micron, and the Micron and M Logos are trademarks of Micron Technology, Inc.
1.875 ±0.050
All other trademarks are the property of their respective owners.
6.00 ±0.10
0.75
TYP
3.75
C L
3.00 ±0.05
Figure 21: 48-Ball FBGA
0.75 TYP
C L
4.00 ±0.05
BALL A1
BALL A1 ID
ASYNC/PAGE CellularRAM MEMORY
24
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
2 MEG x 16, 1 MEG x 16
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag or
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø0.30 SOLDER MASK DEFINED
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
©2004 Micron Technology, Inc. All Rights Reserved.
BALL A1 ID
ADVANCE