MPC8308VMAGD Freescale Semiconductor, MPC8308VMAGD Datasheet - Page 13
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MPC8308VMAGD
Manufacturer Part Number
MPC8308VMAGD
Description
MPU POWERQUICC II PRO 473MAPBGA
Manufacturer
Freescale Semiconductor
Datasheets
1.MPC8308VMAGD.pdf
(90 pages)
2.MPC8308VMAGD.pdf
(2 pages)
3.MPC8308VMAGD.pdf
(1170 pages)
4.MPC8308VMAGD.pdf
(14 pages)
Specifications of MPC8308VMAGD
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
400MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
473-MAPBGA
Product
Network Processor
Data Rate
256 bps
Frequency
400 MHz
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Supply Current (max)
5 uA
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
0 C
Interface
I2C, JTAG, SPI
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8308VMAGD
Manufacturer:
FREESCAL
Quantity:
300
Company:
Part Number:
MPC8308VMAGD
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8308VMAGD
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MPC8308VMAGD400/266
Manufacturer:
FREESCAL
Quantity:
300
Company:
Part Number:
MPC8308VMAGDA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Freescale Semiconductor
MDQ//MDM/MECC output setup with respect to
MDQS
MDQ//MDM/MECC output hold with respect to
MDQS
MDQS preamble start
MDQS epilogue end
Notes:
1. The symbols used for timing specifications follow the pattern of t
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS.
4. Note that t
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC
6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that t
inputs and t
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
t
(A) are setup (S) or output valid time. Also, t
(K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). t
of the DQSS override bits in the TIMING_CFG_2 register. This is typically set to the same delay as the clock adjust in the
CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same
adjustment value. For a description and understanding of the timing modifications enabled by use of these bits, see the
MPC8308 PowerQUICC II Pro Processor Reference Manual .
(MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor.
symbol conventions described in note 1.
DDKHAS
symbolizes DDR timing (DD) for the time t
DDKHMH
(first two letters of functional block)(reference)(state)(signal)(state)
Parameter
follows the symbol conventions described in note 1. For example, t
Table 18. DDR2 SDRAM Output AC Timing Specifications (continued)
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 2
266 MHz
266 MHz
DDKLDX
Symbol
t
t
MCK
t
t
t
t
DDKHDS,
DDKHDX,
DDKHMP
DDKHME
DDKLDS
DDKLDX
symbolizes DDR timing (DD) for the time t
memory clock reference (K) goes from the high (H) state until outputs
1
(first two letters of functional block)(signal)(state) (reference)(state)
for outputs. Output hold time can be read as DDR timing
0.75 x t
0.4 x t
1100
Min
900
MCK
MCK
DDKHMH
DDKHMH
0.6 x t
can be modified through control
Max
describes the DDR timing (DD)
—
—
—
MCK
MCK
memory clock reference
DDKHMP
Unit
ps
ps
ns
ns
follows the
DDR2 SDRAM
Notes
5
5
6
6
for
13