MPC8308VMAGD Freescale Semiconductor, MPC8308VMAGD Datasheet - Page 88
![MPU POWERQUICC II PRO 473MAPBGA](/photos/6/76/67676/mpc8308_sml.jpg)
MPC8308VMAGD
Manufacturer Part Number
MPC8308VMAGD
Description
MPU POWERQUICC II PRO 473MAPBGA
Manufacturer
Freescale Semiconductor
Datasheets
1.MPC8308VMAGD.pdf
(90 pages)
2.MPC8308VMAGD.pdf
(2 pages)
3.MPC8308VMAGD.pdf
(1170 pages)
4.MPC8308VMAGD.pdf
(14 pages)
Specifications of MPC8308VMAGD
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
400MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
473-MAPBGA
Product
Network Processor
Data Rate
256 bps
Frequency
400 MHz
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Supply Current (max)
5 uA
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
0 C
Interface
I2C, JTAG, SPI
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8308VMAGD
Manufacturer:
FREESCAL
Quantity:
300
Company:
Part Number:
MPC8308VMAGD
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8308VMAGD
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MPC8308VMAGD400/266
Manufacturer:
FREESCAL
Quantity:
300
Company:
Part Number:
MPC8308VMAGDA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Document Revision History
25 Document Revision History
Table 63
88
Revision
Rev 2
Rev 1
Rev 0
provides a revision history for this hardware specification.
02/2011
06/2010
05/2010
Date
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 2
Initial release
• Added NV
• In
• In
• In
• In
• In
• In
• In
• In
• In
• In
• In
Added Note-2
Added NV
Added “Extended Temperature range from -40 to 105 °C, in the last row of the table
Changed “characteristic name Junction temperature” to “Operating temperature range”
t
t
Y23 Package Pin Number changed from NC to V
TSEC2_CRS is muxed with GPIO[0], shown as TSEC2_CRS/ GPIO[0]
with 15
TSEC1_TMR_TX_ESFD replaced with TSEC2_TMR_TX_ESFD
TSEC0_TMR_RX_ESFD replaced with TSEC1_TMR_RX_ESFD
TSEC0_TMR_TX_ESFD replaced with TSEC1_TMR_TX_ESFD
DDKHCS
DDKHMP
Table
Table
Table
Figure
Table
Table
Table
Table
Table
Table
Table
2,
4, Note-3, changed ambient temperature to junction temperature, T
18,
53,
58, note-1, core_clk maximum operating frequency 333 MHz replaced with 400 MHz
4, T
8, f
53, TSEC1_TMR_RX_ESFD replaced with TSEC2_TMR_RX_ESFD
56, rows from 1000 to 1111 removed
57, SPMF 5:1 Option 167 MHz added.
changed from 3.15ns to 2.5ns
and t
6, corrected t
DDJ
DDJ
Table 63. Document Revision History
SYS_CLK_IN
A
= 105 replaced with T
DDKHME
to Note-3
to Note-7 in
values updated
DDKHMP
(Max) = 66 replaced with 66.67 and t
Table
& t
1.
DDKHME
Substantive Change(s)
J
= 105
waveform
DD
signal group
SYS_CLK_IN
Freescale Semiconductor
(Min) = 15.15 replaced
J
= 105° C