MPC8308VMAGD Freescale Semiconductor, MPC8308VMAGD Datasheet - Page 80

MPU POWERQUICC II PRO 473MAPBGA

MPC8308VMAGD

Manufacturer Part Number
MPC8308VMAGD
Description
MPU POWERQUICC II PRO 473MAPBGA
Manufacturer
Freescale Semiconductor

Specifications of MPC8308VMAGD

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
400MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
473-MAPBGA
Product
Network Processor
Data Rate
256 bps
Frequency
400 MHz
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Supply Current (max)
5 uA
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
0 C
Interface
I2C, JTAG, SPI
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8308VMAGD
Manufacturer:
FREESCAL
Quantity:
300
Part Number:
MPC8308VMAGD
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8308VMAGD
Manufacturer:
FREESCALE
Quantity:
6
Part Number:
MPC8308VMAGD
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MPC8308VMAGD
Quantity:
2 000
Part Number:
MPC8308VMAGD400/266
Manufacturer:
FREESCAL
Quantity:
300
Part Number:
MPC8308VMAGDA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC8308VMAGDA
Quantity:
4 200
Thermal
22 Thermal
This section describes the thermal specifications of the device.
22.1
Table 59
80
Junction to Ambient Natural Convection
Junction to Ambient Natural Convection
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top
1
2
Note:
0–1
For any core_clk:csb_clk ratios, the core_clk must not exceed its maximum operating frequency of 400 MHz.
Core VCO frequency = core frequency × VCO divider. Note that VCO divider has to be set properly so that the
core VCO frequency is in the range of 400–800 MHz.
10
00
01
10
RCWL[COREPLL]
provides the package thermal characteristics for the 473, 19 × 19 mm MAPBGA.
Thermal Characteristics
Characteristic
0010
0011
0011
0011
2–5
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 2
6
1
0
0
0
Table 59. Package Thermal Characteristics for MAPBGA
Table 58. e300 Core PLL Configuration (continued)
core_clk: csb_clk Ratio
2.5:1
3:1
3:1
3:1
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
Natural Convection
Board Type
1
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJA
θJA
θJB
θJC
JT
VCO Divider (VCOD)
Value
8
2
4
8
42
27
35
24
17
9
2
Freescale Semiconductor
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1,2,3
1,2
1,3
1,3
4
5
6

Related parts for MPC8308VMAGD