PCX7457VGH1000NC Atmel, PCX7457VGH1000NC Datasheet - Page 14

• Manufacturer Part Number: PCX7457VGH1000NC
• Description: IC MPU 32BIT 1000MHZ 483CBGA
• Manufacturer: Atmel

Specifications of PCX7457VGH1000NC

• Processor Type: PowerPC 32-Bit RISC
• Speed: 1.0GHz
• Voltage: 1.1V
• Mounting Type: Surface Mount
• Package / Case: 483-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

6.2.2
6.2.3
14
PC7457
Package Thermal Characteristics for HCTE
Internal Package Conduction Resistance
Table 6-3
Table 6-3.
Notes:
For the exposed-die packaging technology, shown in
tion thermal resistance paths are as follows:
Figure 15-3 on page 55
heat sink mounted to a printed-circuit board.
Figure 6-2.
Note the internal versus external package resistance.
Heat generated on the active side of the chip is conducted through the silicon, then through the
heat sink attach material (or thermal interface material), and finally to the heat sink where it is
removed by forced-air convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the temperature
drop in the silicon may be neglected. Thus, the thermal interface material and the heat sink con-
duction/convective thermal resistances are the dominant terms.
Characteristic
Junction-to-bottom of balls
Junction-to-ambient thermal resistance, natural
convection, four-layer (2s2p) board
Junction to board thermal resistance
• The die junction-to-case (actually top-of-die since silicon die is exposed) thermal resistance
• The die junction-to-ball thermal resistance
External Resistance
External Resistance
1. Simulation, no convection air flow.
2. Per JEDEC JESD51-6 with the board horizontal
Internal Resistance
provides the package thermal characteristics for the PC7457, HCTE.
Package Thermal Characteristics for HCTE Package
C4 Package with Heat Sink Mounted to a Printed-Circuit Board
depicts the primary heat transfer path for a package with an attached
(1)
Printed-Circuit Board
(1)(2)
Heat Sink
Radiation
Radiation
Symbol
R
R
R
Table 6-1 on page
JMA
JB
J
Convection
Convection
PC755 HCTE
Value
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
16.8
3.9
7.6
13, the intrinsic conduc-
5345D–HIREL–07/06
Unit
C/W
C/W
C/W