FW80200M733SL678 Intel, FW80200M733SL678 Datasheet - Page 35

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FW80200M733SL678

Manufacturer Part Number
FW80200M733SL678
Description
IC I/O PROCESSOR 733MHZ 241-BGA
Manufacturer
Intel
Datasheet

Specifications of FW80200M733SL678

Rohs Status
RoHS non-compliant
Processor Type
I/O
Features
XScale Core
Speed
733MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
241-BGA
Other names
844850

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Datasheet - Commercial and Extended Temperature (80200T)
4.9
Figure 16.
Figure 17.
Typical Power Dissipation
The total dissipated power is the sum of the power requirements from the device pins and the
internal logic. Both are dependent on the operating frequency, voltage, and activity. Because the
device pins are operating under different conditions than the internal logic, the typical power
dissipation curves for both are in this section.
Typical Pin Power Dissipation
Typical Core Power Dissipation
1. Assume system driving one PC-100 DIMM and a companion chip with 10pF/pin capacitance.
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0.700
0.600
0.500
0.400
0.300
0.200
0.100
0.000
3.00
0.6
0.7
3.10
Intel
0.8
®
C o r e P owe r ( on D h r y st on e 2 . 1: hi gh c or e a c t i v i t y )
80200 Processor based on Intel
3.20
0.9
Bus Speed vs. Power (M oderate Bus Ut ilization)
1
Vccp (Volts)
1
Vcc (Volts)
3.30
1.1
1.2
3.40
1.3
January 2003
®
1.4
3.50
XScale
Electrical Specifications
1.5
Microarchitecture
3.60
1.6
66 MHz bus
100 MHz bus
400 MHz
600 MHz
35

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