ISP1110VHTS ST-Ericsson Inc, ISP1110VHTS Datasheet - Page 21

IC USB TXRX W/UART 16-HBCC

ISP1110VHTS

Manufacturer Part Number
ISP1110VHTS
Description
IC USB TXRX W/UART 16-HBCC
Manufacturer
ST-Ericsson Inc
Type
Transceiverr
Datasheet

Specifications of ISP1110VHTS

Number Of Drivers/receivers
1/1
Protocol
USB 2.0
Voltage - Supply
4 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
16-HBCC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3149-2
ISP1110VH-G

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
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Manufacturer:
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Quantity:
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Part Number:
ISP1110VHTS
Manufacturer:
ST-ERICS
Quantity:
20 000
NXP Semiconductors
ISP1110_2
Product data sheet
Table 15.
Table 16.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 14. Temperature profiles for large and small components
2.5
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
16
14.
Rev. 02 — 19 March 2007
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
3
3
)
)
350 to 2000
260
250
245
USB transceiver with UART signaling
220
220
350
temperature
peak
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
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