TDGL003 Microchip Technology, TDGL003 Datasheet - Page 164

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

PIC32MX3XX/4XX
FIGURE 29-3:
TABLE 29-21: I/O TIMING REQUIREMENTS
DS61143H-page 164
AC CHARACTERISTICS
DO31
DO32
DI35
DI40
Note 1:
Note: Refer to
Param.
No.
(Output)
I/O Pin
I/O Pin
(Input)
2:
T
T
T
T
Symbol
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.
This parameter is characterized, but not tested in manufacturing.
IO
IO
INP
RBP
R
F
Figure 29-1
Port Output Rise Time
Port Output Fall Time
INTx Pin High or Low Time
CNx High or Low Time (input)
I/O TIMING CHARACTERISTICS
for load conditions.
Characteristics
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
(2)
DO31
DO32
Min.
10
—
—
—
—
2
DI35
DI40
-40°C ≤ T
-40°C ≤ T
Typical
—
—
5
5
5
5
A
A
(1)
≤ +85°C for Industrial
≤ +105°C for V-Temp
Max.
15
10
15
10
—
—
© 2011 Microchip Technology Inc.
T
SYSCLK
Units
ns
ns
ns
ns
ns
Conditions
V
V
V
V
DD
DD
DD
DD
—
—
< 2.5V
> 2.5V
< 2.5V
> 2.5V