TDGL003 Microchip Technology, TDGL003 Datasheet - Page 168

ChipKIT Max32 Development Board PIC32 Boards And Kits

TDGL003

Manufacturer Part Number
TDGL003
Description
ChipKIT Max32 Development Board PIC32 Boards And Kits
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Type
MCUr
Datasheets

Specifications of TDGL003

Silicon Manufacturer
Microchip
Core Architecture
MIPS
Core Sub-architecture
PIC32
Silicon Core Number
PIC32MX
Silicon Family Name
PIC32MX795Fxxxx
Kit Contents
Board Only
Contents
Board
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
MPLAB®, Arduino™ Mega
PIC32MX3XX/4XX
TABLE 29-24: TIMER2, 3, 4, 5 EXTERNAL CLOCK TIMING REQUIREMENTS
DS61143H-page 168
AC CHARACTERISTICS
TB10
TB11
TB15
TB20
Note 1:
Param.
No.
T
T
T
T
CKEXTMRL
TX
TX
TX
Symbol
These parameters are characterized, but not tested in manufacturing.
H
L
P
TxCK
High
Time
TxCK
Low
Time
TxCK
Input
Period
Delay from External
TxCK Clock Edge to
Timer Increment
Characteristics
Synchronous,
with prescaler
Synchronous,
with prescaler
Synchronous,
with prescaler
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
(1)
[(12.5 ns or 1T
[(12.5 ns or 1T
[(Greater of 25 ns or
[(Greater of 25 ns or
2 T
2 T
PB
PB
+ 25 ns
+ 25 ns
)/N] + 30 ns
)/N] + 50 ns
Min.
PB
PB
)/N]
)/N]
-40°C ≤ T
-40°C ≤ T
Max. Units
1
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
T
ns
ns
ns
ns
PB
Must also meet
parameter
TB15.
Must also meet
parameter
TB15.
V
V
© 2011 Microchip Technology Inc.
DD
DD
> 2.7V
< 2.7V
Conditions
N = prescale
value
(1, 2, 4, 8, 16,
32, 64, 256)

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