TDGL003 Microchip Technology, TDGL003 Datasheet - Page 182

ChipKIT Max32 Development Board PIC32 Boards And Kits

TDGL003

Manufacturer Part Number
TDGL003
Description
ChipKIT Max32 Development Board PIC32 Boards And Kits
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Type
MCUr
Datasheets

Specifications of TDGL003

Silicon Manufacturer
Microchip
Core Architecture
MIPS
Core Sub-architecture
PIC32
Silicon Core Number
PIC32MX
Silicon Family Name
PIC32MX795Fxxxx
Kit Contents
Board Only
Contents
Board
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
MPLAB®, Arduino™ Mega
PIC32MX3XX/4XX
TABLE 29-36: ANALOG-TO-DIGITAL CONVERSION TIMING REQUIREMENTS
DS61143H-page 182
AC CHARACTERISTICS
Clock Parameters
AD50
AD51
Conversion Rate
AD55
AD56
AD57
Timing Parameters
AD60
AD61
AD62
AD63
Note 1:
Param.
No.
2:
3:
T
TRC
TCONV
F
T
TPCS
TPSS
TCSS
TDPU
Symbol
AD
SAMP
CNV
These parameters are characterized, but not tested in manufacturing.
Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
Characterized by design but not tested.
Analog-to-Digital Clock Period
Analog-to-Digital Internal RC
Oscillator Period
Conversion Time
Throughput Rate
(Sampling Speed)
Sample Time
Conversion Start from Sample
Trigger
Sample Start from Setting
Sample (SAMP) bit
Conversion Completion to
Sample Start (ASAM = 1)
Time to Stabilize Analog Stage
from Analog-to-Digital OFF to
Analog-to-Digital ON
Characteristics
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
0.5 T
1 T
Min.
65
AD
AD
Typical
1.0 T
0.5 T
12 T
250
AD
AD
AD
(1)
1.5 T
Max.
1000
400
2
-40°C ≤ T
-40°C ≤ T
AD
KSPS
KSPS
Units
© 2011 Microchip Technology Inc.
ns
ns
μs
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
See
Note 2
See Note 3
T
ns.
Auto-Convert Trigger
(SSRC<2:0> = 111)
not selected.
See Note 3
See Note 3
See Note 3
AV
AV
SAMP
DD
DD
Table 29-35
Conditions
must be ≥ 132
= 3.0V to 3.6V
= 2.5V to 3.6V
and

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