PCA9554AD,112 NXP Semiconductors, PCA9554AD,112 Datasheet - Page 23

• Manufacturer Part Number: PCA9554AD,112
• Description: IC I/O EXPANDER I2C 8B 16SOIC
• Manufacturer: NXP Semiconductors

Specifications of PCA9554AD,112

• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Interface: I²C, SMBus
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Includes: POR
• Logic Family: PCA
• Number Of Lines (input / Output): 8
• Operating Supply Voltage: 2.3 V to 5.5 V
• Power Dissipation: 200 mW
• Operating Temperature Range: - 40 C to + 85 C
• Maximum Clock Frequency: 400 KHz
• Mounting Style: SMD/SMT
• Number Of Output Lines: 8
• Output Current: 50 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM6285 - EVAL BOARD I2C-2002-1A568-4002 - DEMO BOARD I2C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1051-5; 935269195112; PCA9554AD

NXP Semiconductors
12. Handling information
13. Soldering
PCA9554_9554A_7
Product data sheet
13.2.1 Soldering by dipping or by solder wave
13.2.2 Manual soldering
13.3.1 Reflow soldering
13.1 Introduction
13.2 Through-hole mount packages
13.3 Surface mount packages
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C
or 265 C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Key characteristics in reflow soldering are:
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
Rev. 07 — 13 November 2006
8-bit I
Figure
2
PCA9554/PCA9554A
C-bus and SMBus I/O port with interrupt
25) than a PbSn process, thus
stg(max)
© NXP B.V. 2006. All rights reserved.
). If the
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