BAS16J NXP Semiconductors, BAS16J Datasheet - Page 5

58T1329

BAS16J

Manufacturer Part Number
BAS16J
Description
58T1329
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS16J

Diode Type
Ultra Fast Recovery
Forward Current If(av)
250mA
Repetitive Reverse Voltage Vrrm Max
100V
Forward Voltage Vf Max
1.25V
Reverse Recovery Time Trr Max
4ns
Rohs Compliant
Yes

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NXP Semiconductors
6. Thermal characteristics
BAS16_SER_5
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Table 7.
Symbol
Per device
T
T
T
Symbol
R
R
j
amb
stg
th(j-a)
th(j-t)
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB with 60 m copper strip line.
Single diode loaded.
T
Reflow soldering is the only recommended soldering method.
Soldering point of cathode tab.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Soldering points at pins 4, 5 and 6.
j
= 25 C prior to surge.
Limiting values
Thermal characteristics
Parameter
junction temperature
ambient temperature
storage temperature
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to tie-point
BAS16
BAS16H
BAS16J
BAS16L
BAS16VV
BAS16W
BAS16
BAS16W
Rev. 05 — 25 August 2008
…continued
Conditions
Conditions
in free air
[2][3]
[3][4]
[3][4]
[2][3]
[2][3]
[3][4]
High-speed switching diodes
[1]
[5]
[5]
[1]
BAS16 series
Min
-
-
-
-
-
-
-
-
-
-
Min
-
65
65
Typ
-
-
-
-
-
-
-
-
-
-
© NXP B.V. 2008. All rights reserved.
Max
150
+150
+150
Max
500
330
150
230
500
700
410
625
330
300
Unit
2
C
C
C
.
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
5 of 20

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