AM29LV800DT-70EC AMD (ADVANCED MICRO DEVICES), AM29LV800DT-70EC Datasheet - Page 13

• Manufacturer Part Number: AM29LV800DT-70EC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29LV800DT-70EC

• Lead Free Status / Rohs Status: Not Compliant

6.
6.1
February 27, 2009 S29AL008D_00_A11
Ordering Information
Standard Products
This product has been retired and is not recommended for designs. For new and current designs, S29AL008J
supercedes S29AL008D. This is the factory-recommended migration path. Please refer to the S29AL008J
data sheet for specifications and ordering information.
Spansion standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the elements below.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Notes
1. Type 0 is standard. Specify other options as required.
2. Type 1 is standard. Specify other options as required.
3. TSOP and SOP package markings omit packing type designator from ordering part number.
4. BGA package marking omits leading S29 and packing type designator from ordering part number.
Device Number
S29AL008D
S29AL008D
55
60, 70, 90
60, 70, 90
60, 70, 90
Option
Speed
Device Number/Description
S29AL008D
8 Megabit Flash Memory manufactured using 200 nm process technology
3.0 Volt-only Read, Program, and Erase
55
55
55
D a t a
T
S29AL008D Valid Combinations
A
MAI, MFI, MAN, MFN
Temperature Range
BAI, BFI, BAN, BFN
TAI, TFI, TAN, TFN
Package Type,
Material, and
S h e e t
MAI, MFI
BAI, BFI
TAI, TFI
I
S29AL008D
RI
0
Packing Type
0 = Tray
1 = Tube
2 = 7” Tape and Reel
3 = 13” Tape and Reel
Model Number
01 = x8/x16, V
R1 = x8/x16, V
02 = x8/x16, V
R2 = x8/x16, V
Temperature Range
I
N = Extended (-40°C to +125°C)
Package Material Set
A = Standard
F = Pb-Free
Package Type
T = Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
M = Small Outline Package (SOP) Standard Pinout
Speed Option
55 = 55 ns Access Speed
60 = 60 ns Access Speed
70 = 70 ns Access Speed
90 = 90 ns Access Speed
Number
R1, R2
R1, R2
R1, R2
Model
01, 02
01, 02
01, 02
= Industrial (-40°C to +85°C)
0, 2, 3
0, 1, 3
Packing Type
CC
CC
CC
CC
0, 3
= 2.7 - 3.6V, top boot sector device
= 3.0 - 3.6V. top boot sector device
= 2.7 - 3.6V, bottom boot sector device
= 3.0 - 3.6V. bottom boot sector device
(Note 1)
(Note 1)
(Note 2)
VBK048
SO044
TS048
Package Description
(Note 3)
(Note 3)
(Note 4)
Fine-Pitch
TSOP
BGA
SOP
13