TE28F800C3TA90 Intel, TE28F800C3TA90 Datasheet - Page 65

• Manufacturer Part Number: TE28F800C3TA90
• Description: Flash Mem Parallel 3V/3.3V 8M-Bit 512K x 16 90ns 48-Pin TSOP
• Manufacturer: Intel

Specifications of TE28F800C3TA90

• Package: 48TSOP
• Density: 8 Mb
• Architecture: Sectored
• Block Organization: Asymmetrical
• Location Of Boot Block: Top
• Typical Operating Supply Voltage: 3|3.3 V
• Sector Size: 8KByte x 8|64KByte x 15
• Support Of Common Flash Interface: Yes
• Timing Type: Asynchronous
• Operating Temperature: -40 to 85 °C
• Interface Type: Parallel

Datasheet
Figure 20. TSOP Package Drawing & Dimensions
Dimensions
1. One dimple on package denotes Pin 1.
2. If two dimples, then the larger dimple denotes Pin 1.
3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
4. Pin 1 will always supersede above pin one notes.
Seating Plane Coplanarity
Package Body Thickness
Lead to Package Offset
Package Body Width
Pin 1
Terminal Dimension
Plastic Body Length
Lead Tip Length
Package Height
Lead Thickness
Lead Tip Angle
Lead Count
Lead Width
Lead Pitch
Standoff
Z
b
Detail B
See Detail A
See Notes 1, 2, 3 and 4
Symbol
D1
A1
A2
A
E
D
N
Ø
Y
Z
b
c
e
L
Family: Thin Small Out -Line Package
18.200 18.400 18.600
11.800 12.000 12.200
19.800 20.000 20.200
D
0.050
0.950
0.150
0.100
0.500
0.150
D
Min
1
0°
Millimeters
1.000
0.200
0.150
0.500
0.600
0.250
Nom
48
3°
Intel
1.200
1.050
0.300
0.200
0.700
0.100
0.350
Detail A
Max
5°
£
Advanced+ Boot Block Flash Memory (C3)
Notes
A
L
E
0.002
0.037
0.006
0.004
0.717
0.465
0.780
0.020
0.006
Min
0°
C
A
2
0
Inches
0.0197
0.039
0.008
0.006
0.724
0.472
0.787
0.024
0.010
Nom
48
3°
0.047
0.041
0.012
0.008
0.732
0.480
0.795
0.028
0.004
0.014
Seating
Plane
Max
A
5°
e
1
See Detail B
Notes
Y
A5568-02
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