EN29LV400AB-70TCP Eon Silicon Solution Inc., EN29LV400AB-70TCP Datasheet

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EN29LV400AB-70TCP

Manufacturer Part Number
EN29LV400AB-70TCP
Description
Manufacturer
Eon Silicon Solution Inc.
Datasheet

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• 3V, single power supply operation
- Full voltage range: 2.7-3.6 volt read and write
- Regulated voltage range: 3.0-3.6 volt read
• High performance
- Access times as fast as 45 ns
• Low power consumption (typical values at 5
- 7 mA typical active read current
- 15 mA typical program/erase current
- 1 μA typical standby current (standard access
• Flexible Sector Architecture:
- One 16 K-byte, two 8 K-byte, one 32 K-byte,
- One 8 K-word, two 4 K-word, one 16 K-word
• Sector protection:
- Hardware locking of sectors to prevent
- Additionally, temporary Sector Unprotect
GENERAL DESCRIPTION
The EN29LV400A is a 4-Megabit, electrically erasable, read/write non-volatile flash memory,
organized as 524,288 bytes or 256,144 words. Any byte can be programmed typically in 8µs. The
EN29LV400A features 3.0V voltage read and write operation, with access times as fast as 45ns to
eliminate the need for WAIT states in high-performance microprocessor systems.
The EN29LV400A has separate Output Enable (OE#), Chip Enable (CE#), and Write Enable (WE#)
controls, which eliminate bus contention issues.
Sector or full chip erase operation, where each Sector can be individually protected against
program/erase operations or temporarily unprotected to erase or program. The device can sustain
a minimum of 100K program/erase cycles on each Sector.
and write operations for compatibility with
high performance 3.3 volt microprocessors.
time to active mode)
and seven 32 K-word sectors (word mode)
MHz)
allows code changes in previously locked
sectors.
operations for battery-powered applications.
and seven 64 K-byte sectors (byte mode)
program or erase operations within individual
sectors
FEATURES
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
EN29LV400A
4 Megabit (512K x 8-bit / 256K x 16-bit) Flash Memory
Boot Sector Flash Memory, CMOS 3.0 Volt-only
Rev. D, Issue Date: 2008/04/25
1
This device is designed to allow either single
• High performance program/erase speed
- Byte/Word program time: 8µs typical
- Sector erase time: 500ms typical
• JEDEC Standard Embedded Erase and
• JEDEC standard DATA# polling and toggle
• Single Sector and Chip Erase
• Sector Unprotect Mode
• Erase Suspend / Resume modes:
• triple-metal double-poly triple-well CMOS
• Low Vcc write inhibit < 2.5V
• minimum 100K program/erase endurance
• Package Options
- 48-pin TSOP (Type 1)
- 48-ball 6mm x 8mm TFBGA
• Commercial and Industrial Temperature
Read or program another Sector during
Erase Suspend Mode
Program Algorithms
bits feature
Flash Technology
cycle
Range
©2005 Eon Silicon Solution, Inc., www.essi.com.tw
EN29LV400A

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EN29LV400AB-70TCP Summary of contents

Page 1

EN29LV400A 4 Megabit (512K x 8-bit / 256K x 16-bit) Flash Memory Boot Sector Flash Memory, CMOS 3.0 Volt-only FEATURES • 3V, single power supply operation - Full voltage range: 2.7-3.6 volt read and write operations for battery-powered applications. - ...

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CONNECTION DIAGRAMS A15 1 A14 2 A13 3 A12 4 A11 5 A10 WE# 11 RESET RY/BY A17 ...

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TABLE 1. PIN DESCRIPTION Pin Name Function A0-A17 Addresses DQ0-DQ14 15 Data Inputs/Outputs DQ15 (data input/output, word mode), DQ15 / A-1 A-1 (LSB address input, byte mode) CE# Chip Enable OE# Output Enable RESET# Hardware Reset Pin RY/BY# Ready/Busy Output ...

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TABLE 2A. TOP BOOT BLOCK SECTOR ARCHITECTURE ADDRESS RANGE Sector (X16) 10 3E000h-3FFFFh 9 3D000h-3DFFFh 8 3C000h-3CFFFh 7 38000h-3BFFFh 6 30000h-37FFFh 5 28000h-2FFFFh 4 20000h-27FFFh 3 18000h-1FFFFh 2 10000h-17FFFh 1 08000h-0FFFFh 0 00000h-07FFFh This Data Sheet may be revised by ...

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TABLE 2B. BOTTOM BOOT BLOCK SECTOR ARCHITECTURE ADDRESS RANGE Sector (X16) 10 38000h-3FFFFh 9 30000h-37FFFh 8 28000h-2FFFFh 7 20000h-27FFFh 6 18000h-1FFFFh 5 10000h-17FFFh 4 08000h-0FFFFh 3 04000h-07FFFh 2 03000h-03FFFh 1 02000h-02FFFh 0 00000h-01FFFh This Data Sheet may be revised by ...

Page 6

PRODUCT SELECTOR GUIDE Product Number Regulated Voltage Range: Vcc=3.0-3.6 V Speed Option Full Voltage Range: Vcc=2.7 – 3.6 V Max Access Time acc Max CE# Access Max OE# Access ...

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TABLE 3. OPERATING MODES Operation CE# Read L Write L ± 0.3V CMOS Standby V cc TTL Standby H Output Disable L Hardware Reset X Temporary Sector Unprotect X Notes: L=logic low H=Logic High ...

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USER MODE DEFINITIONS Word / Byte Configuration The signal set on the BYTE# Pin controls whether the device data I/O pins DQ15-DQ0 operate in the byte or word configuration. When the Byte# Pin is set at logic ‘1’, then the ...

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To access the autoselect codes in-system; the host system can issue the autoselect command via the command register, as shown in the Command Definitions table. This method does not require V . See “Command Definitions” for details on using the ...

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Automatic Sleep Mode The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables this mode when addresses remain stable for t independent of the CE#, WE# and OE# control signals. Standard address access timings provide new data ...

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COMMAND DEFINITIONS The operations of the EN29LV400A are selected by one or more commands written into the command register to perform Read/Reset Memory, Read ID, Read Sector Protection, Program, Sector Erase, Chip Erase, Erase Suspend and Erase Resume. Commands are ...

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Reset Command Writing the reset command to the device resets the device to reading array data. Address bits are don’t-care for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing ...

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The system is not required to provide any controls or timings during these operations. The Command Definitions table shows the address and data ...

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The system must write the Erase Resume command (address bits are don’t-care) to exit the erase suspend mode and continue the sector erase operation. Further writes of the Resume command are ignored. Another Erase Suspend command can be written after ...

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DQ6: Toggle Bit I The EN29LV400A provides a “Toggle Bit” on DQ6 to indicate the status of the embedded programming and erase operations. (See Table 6) During an embedded Program or Erase operation, successive attempts to read data from the ...

Page 16

Flowchart 6 shows the toggle bit algorithm, and the section “DQ2: Toggle Bit” explains the algorithm. See also the “DQ6: Toggle Bit I” subsection. Refer to the Toggle Bit Timings figure for the toggle bit timing diagram. The DQ2 vs. ...

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Table 6. Status Register Bits DQ Name DATA# 7 POLLING TOGGLE 6 BIT 5 ERROR BIT ERASE 3 TIME BIT TOGGLE 2 BIT Notes: DQ7 DATA# Polling: indicates the P/E C status check during Program or Erase, and on completion ...

Page 18

EMBEDDED ALGORITHMS Flowchart 1. Embedded Program Increment No Address Flowchart 2. Embedded Program Command Sequence See the Command Definitions section for more information on WORD mode. 555H / AAH 2AAH / 55H 555H / A0H PROGRAM ADDRESS / PROGRAM DATA ...

Page 19

Flowchart 3. Embedded Erase START Write Erase Command Sequence Data Poll from System or Toggle Bit successfully completed Data =FFh? No Erase Done Flowchart 4. Embedded Erase Command Sequence See the Command Definitions section for more information on WORD mode. ...

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Flowchart 5. DATA# Polling Algorithm Notes: (1) This second read is necessary in case the first read was done at the exact instant when the status data was in transition. Flowchart 6. Toggle Bit Algorithm Notes: (2) This second set ...

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Flowchart 7a. In-System Sector Protect Flowchart Temporary Sector Unprotect Mode Increment PLSCNT PLSCNT = 25? Device failed Sector Protect Algorithm This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. START PLSCNT = ...

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Flowchart 7b. In-System Sector Unprotect Flowchart Protect all sectors: The indicated portion of the sector protect algorithm must be performed for all unprotected sectors prior to issuing the first sector unprotect address (see Diagram 7a.) Increment PLSCNT No PLSCCNT = ...

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Table 7. DC Characteristics (T = 0°C to 70° 40°C to 85° Symbol Parameter Input Leakage Current I LI Output Leakage Current I LO Supply Current (read) TTL (read) CMOS Byte I CC1 (read) CMOS ...

Page 24

Test Conditions Device Under Test C L Note: Diodes are IN3064 or equivalent Test Specifications Test Conditions Output Load Output Load Capacitance, C Input Rise and Fall times Input Pulse Levels Input timing measurement reference levels Output timing measurement reference ...

Page 25

AC CHARACTERISTICS Hardware Reset (Reset#) Parameter Description Std Reset# Pin Low to Read or Write t READY Embedded Algorithms Reset# Pin Low to Read or Write t READY Non Embedded Algorithms t Reset# Pulse Width RP t Reset# High Time ...

Page 26

AC CHARACTERISTICS Word / Byte Configuration (Byte#) Std Parameter Description t Byte# to CE# switching setup time BCS t CE# to Byte# switching hold time CBH t RY/BY# to Byte# switching hold time RBH CE# OE# Byte# CE# WE# Byte# ...

Page 27

Table 8. AC CHARACTERISTICS Read-only Operations Characteristics Parameter Symbols Description JEDEC Standard t t Read Cycle Time AVAV Address to Output Delay AVQV ACC t t Chip Enable To Output Delay ELQV Output Enable ...

Page 28

Table 9. AC CHARACTERISTICS Write (Erase/Program) Operations Parameter Symbols JEDEC Standard Description t t Write Cycle Time AVAV Address Setup Time AVWL Address Hold Time WLAX Data Setup Time DVWH DS ...

Page 29

Table 10. AC CHARACTERISTICS Write (Erase/Program) Operations Alternate CE# Controlled Writes Parameter Symbols Description JEDEC Standard t t Write Cycle Time AVAV Address Setup Time AVEL Address Hold Time ELAX Data ...

Page 30

Table 11. ERASE AND PROGRAMMING PERFORMANCE Parameter Sector Erase Time Chip Erase Time Byte Programming Time Word Programming Time Byte Chip Programming Time Word Erase/Program Endurance Table 12. LATCH UP CHARACTERISTICS Parameter Description Input voltage with respect ...

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AC CHARACTERISTICS Figure 6. AC Waveforms for Chip/Sector Erase Operations Timings Erase Command Sequence (last 2 cycles Addresses 0x2AA CE# t GHWL OE WE Data 0x55 t DS RY/BY VCS ...

Page 32

Figure 7. Program Operation Timings Program Command Sequence (last 2 cycles Addresses 0x555 CE# t GHWL OE WE Data OxA0 t DS RY/BY# t VCS V CC Notes: 1. PA=Program Address, PD=Program ...

Page 33

Figure 8. AC Waveforms for DATA# Polling During Embedded Algorithm Operations t RC Addresses VA t ACC CE OE# t OEH WE# DQ[7] DQ[6:0] t BUSY RY/BY# Notes: 1. VA=Valid Address for reading Data# ...

Page 34

Figure 10. Alternate CE# Controlled Write Operation Timings 0x555 for Program 0x2AA for Erase Addresses t WC WE# t GHEL OE CE Data 0xA0 for Program RY/BY Reset# Notes address ...

Page 35

Figure 12. Sector Protect/Unprotect Timing Diagram V ID Vcc RESET VIDR SA, A6,A1,A0 Data 60h Sector Protect/Unprotect CE# WE# >1μS OE# Notes: Use standard microprocessor timings for this device for read and write cycles. For Sector Protect, use ...

Page 36

FIGURE 14. 48L TSOP 12mm x 20mm package outline This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. ©2005 Eon Silicon Solution, Inc., www.essi.com.tw 36 Rev. D, Issue Date: 2008/04/25 EN29LV400A ...

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FIGURE 15. 48L TFBGA 6mm x 8mm package outline This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. SYMBOL Note : 1. Coplanarity: ...

Page 38

ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Plastic Packages Ambient Temperature With Power Applied Output Short Circuit Current A9, OE#, Reset# Voltage with Respect to Ground Notes more than one output shorted at a time. Duration of the short ...

Page 39

... Regulated range 3.0V~3. 70ns 90 = 90ns BOOT CODE SECTOR ARCHITECTURE T = Top Sector B = Bottom Sector BASE PART NUMBER EN = Eon Silicon Solution Inc. 29LV = FLASH, 3V Read Program Erase 400 = 4 Megabit (512K 256K x 16 Version Identifier ©2005 Eon Silicon Solution, Inc., www.essi.com.tw 39 Rev. D, Issue Date: 2008/04/25 ...

Page 40

Revisions List Revision No Description A Initial Release B 1. Correct the typo of program/erase Endurance cycle to 100K at FEATURES page 1 2. Change the FBGA package dimension to enhance the BGA substrate and ball strength, the difference is ...

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