AD5346 Analog Devices, AD5346 Datasheet - Page 24
AD5346
Manufacturer Part Number
AD5346
Description
2.5 V to 5.5 V, Parallel Interface Octal Voltage Output 8-Bit D/A Converter
Manufacturer
Analog Devices
Datasheet
1.AD5346.pdf
(24 pages)
Specifications of AD5346
Resolution (bits)
8bit
Dac Update Rate
167kSPS
Dac Settling Time
6µs
Max Pos Supply (v)
+5.5V
Single-supply
Yes
Dac Type
Voltage Out
Dac Input Format
Par
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD5346BCP
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD5346BRUZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD5346/AD5347/AD5348
ORDERING GUIDES
Table 11. AD5346 Ordering Guide
Model
AD5346BRU
AD5346BRU-REEL
AD5346BRU-REEL7
AD5346BCP
AD5346BCP-REEL
AD5346BCP-REEL7
Table 12. AD5347 Ordering Guide
Model
AD5347BRU
AD5347BRU-REEL
AD5347BRU-REEL7
AD5347BCP
AD5347BCP-REEL
AD5347BCP-REEL7
Table 13. AD5348 Ordering Guide
Model
AD5348BRU
AD5348BRU-REEL
AD5348BRU-REEL7
AD5348BCP
AD5348BCP-REEL
AD5348BCP-REEL7
© 2003 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Temperature Range
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
Temperature Range
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
Temperature Range
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
C03331–0–11/03(0)
Package Description
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
LFCSP (Lead Frame Chip Scale Package)
LFCSP (Lead Frame Chip Scale Package)
LFCSP (Lead Frame Chip Scale Package)
Package Description
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
LFCSP (Lead Frame Chip Scale Package)
LFCSP (Lead Frame Chip Scale Package)
LFCSP (Lead Frame Chip Scale Package)
Package Description
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
LFCSP (Lead Frame Chip Scale Package)
LFCSP (Lead Frame Chip Scale Package)
LFCSP (Lead Frame Chip Scale Package)
Rev. 0 | Page 24 of 24
Package Option
RU-38
RU-38
RU-38
CP-40
CP-40
CP-40
Package Option
RU-38
RU-38
RU-38
CP-40
CP-40
CP-40
Package Option
RU-38
RU-38
RU-38
CP-40
CP-40
CP-40