ADM1075 Analog Devices, ADM1075 Datasheet - Page 10
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ADM1075
Manufacturer Part Number
ADM1075
Description
?48 V Hot Swap Controller and Digital Power Monitor with PMBus Interface
Manufacturer
Analog Devices
Datasheet
1.ADM1075.pdf
(52 pages)
Specifications of ADM1075
Uv & Ov Detection
OV pin,UVH pin,UVL pin
I Monitor Accuracy (+/-%)
1%
Other Inputs
CONV Pin,RESTARTb,SHDNb
Other Outputs
GPO1/ALERT1b/CONV,GPO2/ALERT2B,LATCHb,PWRGDb,SPLYGDb
Package
28 ld TSSOP,28-ld LFCSP
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ADM1075
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN Pin to VEE
UVL Pin to VEE
UVH Pin to VEE
OV Pin to VEE
ADC_V Pin to VEE
ADC_AUX Pin to VEE
SS Pin to VEE
TIMER Pin to VEE
VCAP Pin to VEE
ISET Pin to VEE
SPLYGD Pin to VEE
LATCH Pin to VEE
RESTART Pin to VEE
SHDN Pin to VEE
PWRGD Pin to VEE
DRAIN Pin to VEE
SCL Pin to VEE
SDAI Pin to VEE
SDAO Pin to VEE
ADR Pin to VEE
GPO1/
GPO2/
PLIM Pin to VEE
GATE Pin to VEE
SENSE+ Pin to VEE
SENSE− Pin to VEE
VEE to VEE_G
Continuous Current into Any Pin
Storage Temperature Range
Operating Junction Temperature
Lead Temperature, Soldering (10 sec)
Junction Temperature
Range
ALERT1
ALERT2
/CONV Pin to VEE
Pin to VEE
Rating
−0.3 V to +14 V
−0.3 V to +4 V
−0.3 V to +4 V
−0.3 V to +4 V
−0.3 V to +4 V
−0.3 V to +4 V
−0.3 V to (VCAP + 0.3 V)
−0.3 V to (VCAP + 0.3 V)
−0.3 V to +4 V
−0.3 V to +4 V
−0.3 V to +18 V
−0.3 V to +18 V
−0.3 V to +18 V
−0.3 V to +18 V
−0.3 V to +18 V
−0.3 V to (VCAP + 0.3 V)
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to (VCAP + 0.3 V)
−0.3 V to +18 V
−0.3 V to +18 V
−0.3 V to +4 V
−0.3 V to +18 V
−0.3 V to +4 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
±10 mA
−65°C to +125°C
−40°C to +105°C
300°C
150°C
Rev. 0 | Page 10 of 52
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
28-Lead TSSOP
1
ESD CAUTION
Measured on JEDEC 4-layer board in still air.
JA
is specified for the worst-case conditions, that is, a device
θ
68
JA
1
θ
20
JC
Data Sheet
Unit
°C/W